isd1800 Winbond Electronics Corp America, isd1800 Datasheet - Page 4

• Manufacturer Part Number: isd1800
• Description: Single-chip, Single-message Voice Record/playback Device 6- To 16-second Duration
• Manufacturer: Winbond Electronics Corp America

4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION ............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION............................................................................................................ 9
8. TIMING DIAGRAMS.......................................................................................................................... 12
9. ABSOLUTE MAXIMUM RATINGS
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 17
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 19
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 20
13. ORDERING INFORMATION........................................................................................................... 24
14. VERSION HISTORY ....................................................................................................................... 25
7.1. Detailed Description
7.2. Functional Description Example
9.1 Operating Conditions
10.1. DC Parameters
10.2. AC Parameters
12.1. 28-Lead 300mil Small Outline IC (SOIC) Package
12.2. 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) – For Sampling Only
12.3. ISD1800 Bonding Physical Layout (Die)
[1]
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[1]
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ISD1800 SERIES
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