lmv358amu8x-nl Fairchild Semiconductor, lmv358amu8x-nl Datasheet - Page 15

• Manufacturer Part Number: lmv358amu8x-nl
• Description: General Purpose, Low Cost, Rro Amplifier
• Manufacturer: Fairchild Semiconductor

LMV321/LMV358/LMV324
LMV324 Package Dimensions
TSSOP
SOIC
REV. 1A April 2004
A
Pin No. 1
NOTES:
SYMBOL
SYMBOL
1 All dimensions are in millimeters (angle in degrees).
2
3
4
5
6
7
8
9
10
A1
Dimensioning and tolerancing per ASME Y14.5–1994.
Dimensions "D" does not include mold flash, protusions or gate burrs. Mold flash protusions or gate burrs shall not exceed 0.15 per side .
Dimension "E1" does not include interlead flash or protusion. Interlead flash or protusion shall not exceed 0.25 per side.
Dimension "b" does not include dambar protusion. Allowable dambar protusion shall be 0.08mm total in excess of the "b" dimension at maximum
material condition. Dambar connot be located on the lower radius of the foot. Minimum space between protusion and adjacent lead is 0.07mm
for 0.5mm pitch packages.
Terminal numbers are shown for reference only.
Datums – A – and – B – to be determined at datum plane – H – .
Dimensions "D" and "E1" to be determined at datum plane – H – .
This dimensions applies only to variations with an even number of leads per side. For variation with an odd number of leads per side, the "center"
lead must be coincident with the package centerline, Datum A.
Cross sections A – A to be determined at 0.10 to 0.25mm from the leadtip.
E1
E1
D
E
N
D
E
N
e
e
ddd C B A
N/2 TIPS
aaa C
2X
2X
– C –
A
A
7
E/2
1.0
2.90
4.30
6.50
4.30
MIN
MIN
e
– A –
10
6
20 Lead
8 Lead
1.0
C L
D
N
1 2 3
0.65 BSC
0.65 BSC
6.4 BSC
6.4 BSC
bbb
6
B
NOM
NOM
4.40
6.50
4.40
1.0 DIA
3.0
20
8
M
ccc
D
C B A
b NX
e
8
e /2
3
C L
MAX
MAX
3.10
4.50
ZD
6.60
4.50
9
A2
A1
E
8
PLANE
E1 E
A2
GAGE
H
0.25
– B –
– H –
A
SYMBOL
SYMBOL
7
E1
E1
D
E
N
D
E
N
e
e
h x 45°
(03)
c
SECTION AA
4.90
4.30
7.70
4.30
MIN
MIN
DETAIL-A
14 Lead
24 Lead
(02)
(L1)
(b)
b1
5
(0.20)
L
0.65 BSC
0.65 BSC
6.4 BSC
6.4 BSC
NOM
NOM
R1
5.00
4.40
7.80
4.40
14
24
R
c1
01
7°
C
DETAIL-A
MAX
MAX
5.10
4.50
7.90
4.50
L
SYMBOL
aaa
bbb
ccc
ddd
A1
A2
R1
b1
01
L1
02
03
E1
c1
A
R
D
E
N
L
b
c
e
e
SYMBOL
SYMBOL
E1
E1
D
E
N
D
E
N
e
e
NOTE:
1. All dimensions are in inches.
2. Lead coplanarity should be 0 to 0.10mm (.004") max.
3. Package surface finishing:
4. All dimensions excluding mold flashes and end flash
0.05
0.85
0.50
0.09
0.09
0.19
0.19
0.09
0.09
4.90
4.30
MIN
(2.1) Top: matte (charmilles #18~30).
(2.2) All sides: matte (charmilles #18~30).
(2.3) Bottom: smooth or matte (charmilles #18~30).
from the package body shall not exceed o.152mm (.006)
per side (d).
0°
–
TSSOP-14
SYMBOL
4.90
4.30
9.50
4.30
MIN
MIN
A1
ZD
A2
16 Lead
C
D
28 Lead
H
B
E
e
h
L
A
0.65 BSC
0.65 BSC
1.0 REF
12° REF
12° REF
6.4 BSC
NOM
0.90
0.60
0.22
0.10
0.10
0.05
0.20
5.00
4.40
14
–
–
–
–
–
–
–
–
0.65 BSC
0.65 BSC
6.4 BSC
6.4 BSC
SOIC-14
NOM
NOM
5.00
4.40
9.70
4.40
16
28
.0040
.0075
.2284
.0099
.014
.337
.150
.016
.060
.054
MIN
0
.050 BSC
0.20 ref
MAX
1.10
0.15
0.95
0.75
0.30
0.25
0.20
0.16
5.10
4.50
8°
–
–
MAX
MAX
5.10
4.50
9.80
4.50
.0098
.0098
.2440
.0196
MAX
.018
.344
.157
.050
.068
.062
8
DATA SHEET
15