lt5519 Linear Technology Corporation, lt5519 Datasheet - Page 11

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lt5519

Manufacturer Part Number
lt5519
Description
0.7ghz To 1.4ghz High Linearity Upconverting Mixer
Manufacturer
Linear Technology Corporation
Datasheet

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PACKAGE DESCRIPTIO
4.35 0.05
2.90 0.05
2.15 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PIN 1
TOP MARK
U
4.00 0.10
(4 SIDES)
16-Lead Plastic QFN (4mm 4mm)
(Reference LTC DWG # 05-08-1692)
0.65 BSC
0.30 0.05
UF Package
0.72 0.05
PACKAGE OUTLINE
0.75 0.05
0.200 REF
0.00 – 0.05
2.15 0.10
(4-SIDES)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
15
16
0.65 BSC
0.30 0.05
LT5519
0.55 0.20
1
2
(UF) QFN 0503
11
5519f

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