tsl1401cs ETC-unknow, tsl1401cs Datasheet - Page 12

• Manufacturer Part Number: tsl1401cs
• Description: Linear Sensor Array With Hold
• Manufacturer: ETC-unknow

TSL1401CS
128 1 LINEAR SENSOR ARRAY WITH HOLD
TAOS036A - AUGUST 2003
Tooling Required
Process
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Copyright E 2003, TAOS Inc.
This product has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The
process, equipment, and materials used in these tests are detailed below.
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1. Apply solder paste using stencil
2. Dispense adhesive dots
3. Place component
4. Reflow solder/cure
5. X-Ray verify
Placement of the TSL1401CS device onto the gold immersion substrate is accomplished using a standard
surface mount manufacturing process. First, using the stencil with 0.36 mm square aperture, print solder paste
onto the substrate. Next, dispense two 0.25 mm to 0.4 mm diameter dots of adhesive in opposing corners of
the TSL1401CS mounting area. Machine place the TSL1401CS from the JEDEC waffle carrier onto the
substrate. A suggested pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has
a rubber tip with a diameter of approximately 0.75 mm. The part is picked up from the center of the body. Reflow
the solder and cure the adhesive using the solder profile shown in Figure 15.
It is important to use a substrate that has an immersion plating surface. This may be immersion gold, silver, or
white tin. Hot air solder leveled substrates (HASL) are not coplanar and should not be used.
Solder stencil (round aperture size 0.36 mm, stencil thickness of 152.4 m)
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MANUFACTURING INFORMATION
Figure 15. TSL1401CS Solder Profile
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