tsl1018 STMicroelectronics, tsl1018 Datasheet - Page 12

• Manufacturer Part Number: tsl1018
• Description: 18 + 1 Channel Buffer For Tft-lcd Panels
• Manufacturer: STMicroelectronics

Package information
4
12/15
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Table 4.
Ref.
ccc
A1
A2
D1
D2
D3
E1
E2
E3
L1
A
D
E
b
e
L
c
k
®
packages. These packages have a lead-free second level interconnect. The
TQFP48 ePad package mechanical data
Min.
0.05
0.95
0.17
0.09
8.80
6.80
2.00
8.80
6.80
2.00
0.45
0°
Millimeters
Typ.
1.00
0.22
9.00
7.00
5.50
9.00
7.00
5.50
0.50
0.60
1.00
3.5°
Max.
1.20
0.15
1.05
0.27
0.20
9.20
7.20
9.20
7.20
0.75
0.08
7°
Dimensions
0.002
0.037
0.007
0.004
0.346
0.268
0.079
0.346
0.268
0.079
0.018
Min.
0°
Inches
0.039
0.009
0.354
0.276
0.217
0.354
0.276
0.217
0.020
0.024
0.039
Typ.
3.5°
TSL1018
0.047
0.006
0.041
0.011
0.008
0.362
0.283
0.362
0.283
0.030
0.003
Max.
7°