MC10EP31DTG ON Semiconductor, MC10EP31DTG Datasheet - Page 3

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MC10EP31DTG

Manufacturer Part Number
MC10EP31DTG
Description
IC FLIP FLOP ECL SET/RST 8TSSOP
Manufacturer
ON Semiconductor
Series
10EPr
Type
D-Typer
Datasheet

Specifications of MC10EP31DTG

Function
Set(Preset) and Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
1
Frequency - Clock
3GHz
Delay Time - Propagation
340ps
Trigger Type
Positive Edge
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output High, Low
-
Other names
MC10EP31DTGOS
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 4. MAXIMUM RATINGS
V
V
V
I
T
T
q
q
q
q
q
T
q
Symbol
out
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
EE
I
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
Parameter
Pb−Free
Pb
http://onsemi.com
V
V
V
V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
EE
CC
EE
CC
Condition 1
= 0 V
= 0 V
= 0 V
= 0 V
3
V
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
I
I
v V
w V
Condition 2
CC
EE
−65 to +150
−40 to +85
41 to 44
41 to 44
35 to 40
Rating
100
190
130
185
140
129
265
265
−6
−6
50
84
6
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
mA
°C
°C
°C
V
V
V
V

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