NBSG53AMNG ON Semiconductor, NBSG53AMNG Datasheet - Page 17

• Manufacturer Part Number: NBSG53AMNG
• Description: IC FLIP FLOP DIFF CLOCK 16QFN
• Manufacturer: ON Semiconductor
• Type: D-Type Busr

Specifications of NBSG53AMNG

• Function: Reset
• Output Type: Differential
• Number Of Elements: 1
• Number Of Bits Per Element: 2
• Frequency - Clock: 8GHz
• Trigger Type: Positive, Negative
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TQFN Exposed Pad
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: QFN EP
• Pin Count: 16
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Delay Time - Propagation: -
• Lead Free Status / Rohs Status: Compliant
• Other names: NBSG53AMNGOS

LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−Y−
3 X
E
A
e
0.20
S
A2
−X−
ROTATED 90 CLOCKWISE
A1
VIEW M−M
4
DETAIL K
3
D
_
4
2
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
−Z−
CASE 489−01
FCBGA−16
BA SUFFIX
M
M
K
ISSUE O
Z
Z
17
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
D
b
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
1.20 REF
MAX
0.35
0.50