25lc256 Microchip Technology Inc., 25lc256 Datasheet - Page 19

• Manufacturer Part Number: 25lc256
• Description: 256k Spi Bus Serial Eeprom
• Manufacturer: Microchip Technology Inc.

© 2007 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
NOTE 1
A
A1
b
N
1
2
D
e
Dimension Limits
A2
E1
c
E
Units
A2
A1
E1
L1
N
E
D
e
A
L
b
φ
c
L1
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
0°
–
25AA256/25LC256
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
3.00
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-086B
L
MAX
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8°
φ
DS21822F-page 19