w25q16cl Winbond Electronics Corp America, w25q16cl Datasheet - Page 69

• Manufacturer Part Number: w25q16cl
• Description: 2.5v 16m-bit Serial Flash Memory With Dual And Quad Spi
• Manufacturer: Winbond Electronics Corp America

13.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
13. PACKAGE SPECIFICATION
SEATING PLANE
SEATING PLANE
Y
Y
SYMBOL
8
8
1
1
E
D
Y
e
H
A1
A
θ
b
c
L
(2)
(3)
(3)
(4)
E
b
b b b
D
D
Min
0.19
1.35
0.10
0.33
3.80
4.80
5.80
0.40
---
0°
MILLIMETERS
e
e
1.27 BSC
5
5
4
4
A1
A1
Max
E H
E H
E H
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
A
A
10°
- 69 -
E
E
E
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
---
0°
Publication Release Date: July 08, 2010
0.050 BSC
INCHES
Max
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
0.25
0.25
10°
Preliminary - Revision A
W25Q16CL
GAUGE PLANE
GAUGE PLANE
c
c
L
L
θ
θ