w9425g6eh Winbond Electronics Corp America, w9425g6eh Datasheet - Page 2

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w9425g6eh

Manufacturer Part Number
w9425g6eh
Description
4 M ? 4 Banks ? 16 Bits Ddr Sdram
Manufacturer
Winbond Electronics Corp America
Datasheet

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8.
9.
10.
11.
OPERATION MODE .................................................................................................................... 17
8.1
8.2
8.3
8.4
ELECTRICAL CHARACTERISTICS ............................................................................................ 23
9.1
9.2
9.3
9.4
9.5
9.6
9.7
SYSTEM CHARACTERISTICS FOR DDR SDRAM .................................................................... 30
10.1 Table 1: Input Slew Rate for DQ, DQS, and DM ............................................................... 30
10.2 Table 2: Input Setup & Hold Time Derating for Slew Rate................................................ 30
10.3 Table 3: Input/Output Setup & Hold Time Derating for Slew Rate .................................... 30
10.4 Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate .................... 30
10.5 Table 5: Output Slew Rate Characteristics (X16 Devices only) ........................................ 30
10.6 Table 6: Output Slew Rate Matching Ratio Characteristics .............................................. 31
10.7 Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins ............. 31
10.8 Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins .............. 32
10.9 System Notes: ................................................................................................................... 33
TIMING WAVEFORMS ................................................................................................................ 35
11.1 Command Input Timing ..................................................................................................... 35
11.2 Timing of the CLK Signals ................................................................................................. 35
11.3 Read Timing (Burst Length = 4) ........................................................................................ 36
11.4 Write Timing (Burst Length = 4) ........................................................................................ 37
11.5 DM, DATA MASK (W9425G6EH) ..................................................................................... 38
11.6 Mode Register Set (MRS) Timing ..................................................................................... 39
11.7 Extend Mode Register Set (EMRS) Timing....................................................................... 40
7.10.2 Addressing Mode Select (A3)...............................................................................................15
7.10.3 CAS Latency field (A6 to A4)................................................................................................16
7.10.4 DLL Reset bit (A8) ................................................................................................................16
7.10.5 Mode Register /Extended Mode register change bits (BA0, BA1) ........................................16
7.10.6 Extended Mode Register field ..............................................................................................16
7.10.7 Reserved field ......................................................................................................................16
Simplified Truth Table........................................................................................................ 17
Function Truth Table ......................................................................................................... 18
Function Truth Table for CKE............................................................................................ 21
Simplified Stated Diagram ................................................................................................. 22
Absolute Maximum Ratings............................................................................................... 23
Recommended DC Operating Conditions ......................................................................... 23
Capacitance....................................................................................................................... 24
Leakage and Output Buffer Characteristics ...................................................................... 24
DC Characteristics............................................................................................................. 25
AC Characteristics and Operating Condition..................................................................... 26
AC Test Conditions............................................................................................................ 28
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Publication Release Date:May 07, 2008
W9425G6EH
Revision A05

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