is45s32200e Integrated Silicon Solution, Inc., is45s32200e Datasheet - Page 59

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is45s32200e

Manufacturer Part Number
is45s32200e
Description
512k Bits X 32 Bits X 4 Banks 64-mbit Synchronous Dynamic Ram
Manufacturer
Integrated Silicon Solution, Inc.
Datasheet

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PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. C
01/28/02
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
A
C
D
E
b
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
Millimeters
0.71 REF
0.05
0.30
0.12
0.80 BSC
0.40
Max
1.20
0.15
0.45
0.21
0.60
54
D
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
Inches
Max
0.047
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
C
D
A
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.16 BSC
11.56 11.96
0.05
0.95
0.17
0.12
0.40
0.80 REF
0.61 REF
0.50 BSC
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
.
86
Min
0.867 0.8827
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.400 BSC
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
Inches
0.024 BSC
Max
0.047
should be
C
1

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