lt3050 Linear Technology Corporation, lt3050 Datasheet - Page 19
![no-image](/images/manufacturer_photos/0/3/389/linear_technology_corporation_sml.jpg)
lt3050
Manufacturer Part Number
lt3050
Description
100ma, Low Noise Linear Regulator With Precision Current Limit And Diagnostic Functions
Manufacturer
Linear Technology Corporation
Datasheet
1.LT3050.pdf
(20 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
lt3050EDDB
Manufacturer:
LT
Quantity:
10 000
Part Number:
lt3050EDDB#PBF
Manufacturer:
LTNEATR
Quantity:
20 000
Company:
Part Number:
lt3050EDDB#PBF/ID
Manufacturer:
LT
Quantity:
3 800
Part Number:
lt3050EDDB#TRMPBF
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
lt3050EDDB-3.3
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
lt3050EDDB-3.3#PBF
Manufacturer:
LT
Quantity:
3 766
Company:
Part Number:
lt3050EDDB-5
Manufacturer:
LT
Quantity:
10 000
Part Number:
lt3050EDDB-5#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
lt3050EMSE
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
lt3050EMSE#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
PACKAGE DESCRIPTION
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(.0165 .0015)
2.55 ±0.05
0.42 0.038
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
TYP
GAUGE PLANE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
(.007)
1.15 ±0.05
0.18
RECOMMENDED SOLDER PAD LAYOUT
0.25 ± 0.05
(.206)
5.23
MIN
0.64 ±0.05
(2 SIDES)
2.845 0.102
(.112 .004)
(.010)
0.254
2.39 ±0.05
(2 SIDES)
DETAIL “A”
DETAIL “A”
1.651 0.102
(.065 .004)
(.0256)
0.65
BSC
0 – 6 TYP
0.45 BSC
(.021 .006)
0.53 0.152
0.70 ±0.05
0.889 0.127
(.035 .005)
(.126 – .136)
3.20 – 3.45
SEATING
PACKAGE
OUTLINE
PLANE
12-Lead Plastic MSOP Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev B)
(Reference LTC DWG # 05-08-1723 Rev Ø)
(.009 – .015)
12-Lead Plastic DFN (3mm × 2mm)
0.22 – 0.38
(.193 .006)
(SEE NOTE 6)
4.90 0.152
TYP
TOP MARK
PIN 1 BAR
(.043)
MAX
1.10
0.200 REF
EXPOSED PAD OPTION
(.0256)
MSE Package
1
0.650
DDB Package
BSC
12
BOTTOM VIEW OF
12 11 10 9 8 7
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAG
1 2 3 4 5 6
2.845 0.102
4.039 0.102
(.112 .004)
(.159 .004)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
(NOTE 3)
3.00 ±0.10
(2 SIDES)
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
7
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
6
DETAIL “B”
(.118 .004)
3.00 0.102
(NOTE 4)
0.406 0.076
(.016 .003)
MSOP (MSE12) 0608 REV B
(.034)
0.86
REF
0.1016 0.0508
(.004 .002)
REF
2.00 ±0.10
0.75 ±0.05
(2 SIDES)
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
0 – 0.05
R = 0.05
DETAIL “B”
0.12 REF
0.64 ± 0.10
(2 SIDES)
TYP
0.23 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.35
REF
R = 0.115
7
6
TYP
2.39 ±0.10
(2 SIDES)
1
12
0.40 ± 0.10
0.45 BSC
LT3050
PIN 1
R = 0.20 OR
0.25 45°
CHAMFER
(DDB12) DFN 0106 REV Ø
19
3050f