lx1991 Microsemi Corporation, lx1991 Datasheet - Page 8

• Manufacturer Part Number: lx1991
• Description: Six Output Programmable Led Current Sink
• Manufacturer: Microsemi Corporation

Copyright © 2001
Rev. 1.1, 10/27/2005
minimum gap
A1
0.30mm Dia.
Maximum
2.50mm
E
0.15mm
LQ
LQ
TM
A3
Top View
16-Pin PCB Land Guidelines and Thermal Pad Design
16-Pin MLPQ Plastic (4x4mm EP)
D
1 - 1.2mm
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
0.05mm minimum
0.5mm
0.28mm
A
0.15mm minimum
0.37mm Nominal
M E C H A N I C A L D R A W I N G
e
b
D2
Integrated Products
®
E2
Microsemi
Pin 1 Indicator
(bottom of Package)
Thermal Via
Package Pad
PCB Land
K
L
Six Output Programmable LED Current Sink
Note:
The typical land pattern shown includes thermal vias in the
exposed die attach pad for improved thermal performance.
Vias should be about 0.3mm in diameter, with the via
plated to about 1.0 ounce copper. Vias should be plugged
to prevent voids being formed due to capillary action. This
can be avoided by tenting the via during the solder mask
process. In addition, to reduce solder paste volume on the
thermal land, it is recommended that an array of small
apertures in the solder mask be used instead of one large
aperture, with the goal of 50 – 80% solder paste coverage.
Please review IPC / EIA J-Std-001C Section 9.2.6.4
“Bottom Only Termination” for solder joint requirements.
1. Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm(.006”) on any side.
Lead dimension shall not include solder coverage.
A1
A3
D2
E2
Dim
D
A
E
K
b
e
L
P
RODUCTION
0.80
0.18
0.23
2.55
2.55
0.20
0.30
MIN
M
0
4.00 BSC
4.00 BSC
0.65 BSC
ILLIMETERS
MAX
1.00
0.05
0.30
0.38
2.80
2.80
0.50
D
ATA
-
S
HEET
0.031
0.007
0.009
0.100
0.100
0.008
0.012
MIN
0.157 BSC
0.026 BSC
0.157 BSC
0
I
NCHES
0.039
0.002
0.012
0.015
0.110
0.110
0.020
MAX
LX1991
Page 8