lx1996 Microsemi Corporation, lx1996 Datasheet - Page 19

• Manufacturer Part Number: lx1996
• Description: Multi-string Led Back-light Controller
• Manufacturer: Microsemi Corporation

Copyright © 2007
Rev. 1.0, 2007-12-14
PCB L
(S
It is recommended that decoupling capacitors C7 and C4 be placed as close as possible to the LX1996. The Inductor current sense
resistor R1 must tie directly to PGND pin, and then tie to the power ground plane at that pin.
For a good practical layout of switching boost circuit, keep loops as short as possible for the boost switching components ( Q1,
L1, D1, & C3). Connect a separate signal ground plane to GND pin, a separate power ground plane to PGND pin, and then tie
them together at GND pin.
It is important that the LX1996 have a good thermal path to ambient to dissipate heat. The simplest way to do this is to heat sink
the LX1996 bottom pad directly to the ground plane by placing 4 or more vias in the ground pad directly under the LX1996
footprint.
Place the LDO filter capacitor (C5), R5 (R
IC as practical.
PCB LAYOUT GUIDE – T
EE FIGURE
AYOUT
TM
2
R
SCHEMATIC
ECOMMENDATIONS
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
)
OP
L
AYER
Actual PCB size (H x W): 10mm x 40mm
T
resistor), C2 (C
P C B L A Y O U T G U I D E
Analog Mixed Signal Group
Microsemi
®
T
capacitor), C1 (C
Multi-string LED Back-light Controller
LF
P
capacitor), and R4 (R
RODUCTION
D
ATASHEET
PRG
resistor) as close to the
LX1996
Page 19