a8504 Allegro MicroSystems, Inc., a8504 Datasheet - Page 18

• Manufacturer Part Number: a8504
• Description: Wled/rgb Backlight Driver For Medium Size Lcds
• Manufacturer: Allegro MicroSystems, Inc.

A8504
mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
Copyright ©2007, Allegro MicroSystems, Inc.
The products described here are manufactured under one or more U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per-
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
27X
0.08
D
C
0.20
2
1
1
2
0.40
26
26
A
Bottom View
0.40
Top View
WLED/RGB Backlight Driver for Medium Size LCDs
4.00
2.45
For the latest version of this document, visit our website:
B
Package EC, 4 × 4 mm 26-Pin QFN/MLP
4.00
SEATING
PLANE
0.75
1.23
1.10
www.allegromicro.com
C
A Terminal #1 mark area
B Exposed thermal pad (reference only, terminal #1
D
C
All dimensions nomianl, not for tooling use
(reference JEDEC MO-220WGGE)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
identifier appearance at supplier discretion)
Coplanarity includes exposed thermal pad and terminals
Reference land pattern layout (reference IPC7351
QFN40P400X400X80-29M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
0.95
1
2
PCB Layout Reference View
26
C
2.45
4.00
115 Northeast Cutoff
1.508.853.5000; www.allegromicro.com
Allegro MicroSystems, Inc.
Worcester, Massachusetts 01615-0036 U.S.A.
0.20
0.40
1.10
1.23
4.00
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