lx1675 Microsemi Corporation, lx1675 Datasheet - Page 2

• Manufacturer Part Number: lx1675
• Description: Multiple Output Loadshare?? Pwm Production Data Sheet
• Manufacturer: Microsemi Corporation

Copyright © 2004
Rev. 1.2a, 2006-02-16
Supply Voltage (VIN
Supply Voltage (VCCL) ................................................................................ -0.3V to 6.0V
Driver Supply Voltage (VCX) ........................................................................ -0.3V to 30V
Current Sense Inputs (CSX)............................................................................ -0.3V to 30V
Error Amplifier Inputs (FB
Internal regulator Current (I
Output Drive Peak Current Source (HO
Output Drive Peak Current Sink (HO
Differential Voltage: V
Soft Start Input (SSX, SSL) ............................................................................-0.3V to V
Logic Inputs (SF, FS)..........................................................................-0.3V to V
LDO Gate Drive (LDGD) Output Drive can source .................................................. 10mA
LDO Feedback (LDFB) Input.......................................................................................6.0V
Operating Junction Temperature................................................................................ 150°C
Operating Temperature Range .......................................................................-40°C to 85°C
Storage Temperature Range.........................................................................-65°C to 150°C
Peak Package Solder Reflow Temp. (40 seconds maximum exposure) ......... 260°C (+0 -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Junction Temperature Calculation: T
The θ
performance of the device/pc-board system. All of the above assume no ambient airflow.
LQ
THERMAL RESISTANCE
JA
Ground. Currents are positive into, negative out of specified terminal
x denotes respective pin designator 1, 2, or 3.
TM
Limitations affecting transient pulse duration is thermally related to the clamping zener
diodes connected to the supply pins, application of maximum voltage will increase current
into that pin and increase power dissipation.
numbers are dependent on heat spreading and layout considerations for the thermal
Plastic MLPQ 38-Pin
A B S O L U T E M A X I M U M R A T I N G S
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
,
VSLR, HRX) ............................................................... -0.3V to 24V
HOX
X
– V
VCCL
, RF2, LDFB) .................................................... -0.3V to 5.5V
-
JUNCTION TO
HRX
T H E R M A L D A T A
)............................................................................... 50mA
J
= T
(High Side Return) .................................... -0.3V to 6V
X
A
, LO
+ (P
X
, LO
D
X
x θ
) ................................................. 1.5A (200ns)
A
X
) ................................................ 1A (200ns)
JA
MBIENT
).
Integrated Products Division
Microsemi
, θ
®
JA
.
Multiple Output LoadSHARE™ PWM
30 to 55°C/W
CCL
+ 0.5V
P
RODUCTION
REF
HO2
HR2
EO2
EO1
LO2
VC2
CS2
SS2
RF2
FB2
FB1
RoHS / Pb-free 100% Matte Tin Lead Finish
SF
D
P A C K A G E P I N O U T
ATA
10
11
12
1
2
3
4
5
6
7
8
9
13
38
S
Connect Bottom to
14
37
HEET
LQ P
Power GND
15
36
(Top View)
16
35
ACKAGE
17
34
18
33
19
32
LX1675
31
30
29
28
27
26
25
24
23
22
21
20
HR3
LO3
PG3
VCCL
VIN
CS1
DGND
CS3
FS
EO3
FB3
SS3
Page 2