ncv87706ds50r4g ON Semiconductor, ncv87706ds50r4g Datasheet - Page 3

• Manufacturer Part Number: ncv87706ds50r4g
• Description: Ncv8770 - Low Dropout Regulator With Reset
• Manufacturer: ON Semiconductor

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 V or (V
3. This device series incorporates ESD protection and is tested by the following methods:
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm
7. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
8. Minimum V
ABSOLUTE MAXIMUM RATINGS
ESD CAPABILITY
LEAD SOLDERING TEMPERATURE AND MSL
THERMAL CHARACTERISTICS
RECOMMENDED OPERATING RANGE
Input Voltage (Note 1)
Input Current
Output Voltage (Note 2)
Output Current
DT (Reset Delay Time Select) Voltage
DT (Reset Delay Time Select) Current
Reset Output Voltage
Reset Output Current
Junction Temperature
Storage Temperature
ESD Capability, Human Body Model
ESD Capability, Machine Model
ESD Capability, Charged Device Model
Moisture Sensitivity Level
Lead Temperature Soldering
Thermal Characteristics
Input Voltage (Note 8)
Junction Temperature
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
Reflow (SMD Styles Only), Pb−Free Versions
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
in
in
+ 0.3 V) (whichever is lower).
= 5.5 V or (V
(Note 3)
Rating
Rating
Rating
Rating
out
Rating
+ V
DO
), whichever is higher.
(Note 5)
Transient, t < 100 ms
2
(or 1 in
(Note 7)
2
) of 1 oz copper thickness and FR4 PCB substrate.
(Note 4)
http://onsemi.com
DC
ESD
ESD
Symbol
Symbol
Symbol
Symbol
ESD
3
Symbol
T
R
R
V
V
V
I
I
V
I
T
V
MSL
RO
T
STG
YJC
T
I
out
DT
qJA
out
RO
in
DT
SLD
in
in
J
HBM
CDM
J
MM
−200
−0.3
−0.3
−0.3
−0.3
Min
−40
−55
Min
Min
−40
5.5
−5
−3
−1
−3
−2
−1
Min
−
−
Value
8.4
53
1
Current Limited
265 peak
Max
Max
Max
150
150
200
150
5.5
5.5
5.5
40
45
40
Max
−
1
3
2
1
°C/W
Unit
Unit
Unit
Unit
mA
mA
mA
mA
Unit
kV
kV
°C
°C
°C
V
V
V
V
V
°C
V
−