l9958 STMicroelectronics, l9958 Datasheet - Page 34

• Manufacturer Part Number: l9958
• Description: Low Rdson Spi Controlled H-bridge
• Manufacturer: STMicroelectronics

Package information
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Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 23. PowerSO-20 mechanical data and package dimensions
E1 (1)
(1) “D and E1” do not include mold flash or protusions.
(2) For subcontractors, the limit is the one quoted in jedec MO-166
D1 (2)
D (1)
DIM.
E2
E3
- Critical dimensions: “E”, “G” and “a3”.
a1
a2
a3
e3
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
A
E
G
H
N
S
b
c
e
h
L
T
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
E2
MIN.
0.23
15.8
13.9
10.9
15.5
N
h x 45˚
0.1
0.4
9.4
5.8
0.8
0
0
b
N
11.43
TYP.
20
1.27
mm
1
10
DETAIL A
MAX.
0.53
0.32
14.5
11.1
15.9
3.6
0.3
3.3
0.1
9.8
2.9
6.2
0.1
1.1
1.1
16
8˚(max. )
8˚(typ.)
e3
D
H
0.004
0.000
0.016
0.009
0.622
0.370
0.547
0.429
0.228
0.000
0.610
0.031
MIN.
Doc ID 17269 Rev 1
1
T
0.050
0.450
0.394
TYP.
inch
11
0
MAX.
0.142
0.012
0.130
0.004
0.021
0.013
0.630
0.386
0.570
0.437
0.114
0.244
0.004
0.626
0.043
0.043
e
a2
E1
A
PSO20MEC
DETAIL B
Weight: 1.9gr
BOTTOM VIEW
R
Gage Plane
a3
MECHANICAL DATA
lead
PowerSO-20
DETAIL B
OUTLINE AND
S
JEDEC MO-166
0.35
D1
E
L
a1
DETAIL A
(COPLANARITY)
E3
slug
c
SEATING PLANE
G C
- C -
0056635 I
L9958
®