xc8102 TOREX SEMICONDUCTOR LTD., xc8102 Datasheet - Page 18

• Manufacturer Part Number: xc8102
• Description: Load Switch With Low On-resistance
• Manufacturer: TOREX SEMICONDUCTOR LTD.

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■PACKAGING INFORMATION (Continued)
2.
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
XC8102
Through-hole: 4 x 0.8 Diameter
Board Mount (Tj max = 125℃)
2. Power Dissipation vs. Ambient Temperature
Ambient Temperature（℃）
Measurement Condition (Reference data)
Condition: Mount on a board
Soldering: Lead (Pb) free
Thickness: 1.6 mm
Ambient: Natural convection
Material: Glass Epoxy (FR-4)
Board: Dimensions 40 x 40 mm (1600 mm
700
600
500
400
300
200
100
0
25
In top and back faces
Package heat-sink is tied to the copper traces
Copper (Cu) traces occupy 50% of the board area
25
85
Series
45
Pd-Ta特性グラフ
Power Dissipation Pd（mW）
Ambient Temperature Ta(℃)
周囲温度Ta（℃）
65
Pd vs Ta
640
240
2
in one side)
85
105
Thermal Resistance (℃/W)
Evaluation Board (Unit: mm)
166.67
125
40.0
28.9
2.5