tda3190 STMicroelectronics, tda3190 Datasheet - Page 8

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tda3190

Manufacturer Part Number
tda3190
Description
Complete Tv Sound Channel
Manufacturer
STMicroelectronics
Datasheet

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TDA3190
MOUNTING INSTRUCTION
The Rth j-amb of the TDA3190 can be reduced by
soldering the GND pins to a suitable copper area
of the printed circuit board (fig. 18) or to an external
heatsink (fig. 19).
The diagram of figure 20 shows the maximum
dissipable power Ptot and the Rth j-amb as a func-
tion of the side ”l” of two equal square copper areas
Figure 18 : Example of P.C. Board Copper Area
Figure 20 : Maximum Dissipable Power and Junc-
8/9
which is used as Heatsink
tion to Ambient Thermal Resistance
versus Side ”T”
having a thickness of 35 µ (1.4 mils).
During soldering the pins temperature must not
exceed 260 C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 19 : External Heatsink Mounting Example
Figure 21 : Maximum Allowable Power Dissipa-
tion versus Ambient Temperature

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