NBSG53AMN ON Semiconductor, NBSG53AMN Datasheet - Page 18
![no-image](/images/manufacturer_photos/0/4/495/on_semiconductor_sml.jpg)
NBSG53AMN
Manufacturer Part Number
NBSG53AMN
Description
IC FLIP FLOP DIFF CLOCK 16QFN
Manufacturer
ON Semiconductor
Type
D-Type Busr
Datasheet
1.NBSG53AMNR2G.pdf
(18 pages)
Specifications of NBSG53AMN
Function
Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
2
Frequency - Clock
8GHz
Trigger Type
Positive, Negative
Voltage - Supply
2.375 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TQFN Exposed Pad
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output High, Low
-
Delay Time - Propagation
-
Other names
NBSG53AMNOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PUBLICATION ORDERING INFORMATION
GigaComm is a trademark of Semiconductor Components Industries, LLC.
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
16 X
0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
PIN 1
L
0.15 C
NOTE 3
A B
16X
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
Ç Ç
Ç Ç
4
1
16
BOTTOM VIEW
SIDE VIEW
TOP VIEW
5
D2
D
e
13
8
(A3)
12
9
EXPOSED PAD
A1
e
A
B
E
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
E2
A
http://onsemi.com
CASE 485G−01
C
16 PIN QFN
SEATING
PLANE
ISSUE C
18
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.575
0.022
0.128
3.25
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
0.012
DIM
A1
A3
D2
E2
0.30
max
A
b
D
E
K
L
e
0.128
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CONDITION CAN NOT VIOLATE 0.2 MM
3.25
MILLIMETERS
0.80
0.00
0.18
1.65
1.65
0.30
MIN
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.50
0.02
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
NBSG53A/D
0.30
inches
mm