bd4729g ROHM Co. Ltd., bd4729g Datasheet - Page 7

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bd4729g

Manufacturer Part Number
bd4729g
Description
Bipolar Voltage Detector Ic
Manufacturer
ROHM Co. Ltd.
Datasheet

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10. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the
Operation Notes
Please verify and confirm using practical applications.
External parameters
Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.
Absolute maximum range
Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode,
such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be
beyond absolute maximum ratings is considered.
GND potential
GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient
feature.
Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
Bypass Capacitor for Noise Rejection
Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and VCC pin, Output pin and GND pin, or VCC pin and GND pin. When soldering the IC on circuit
board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be
destroyed.
This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected
operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal
and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance.
Power on reset operation
Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use
proper discharge procedure before each process of the test operation.
To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could
sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before
attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is
OFF before removing any component connected to the test setup.
couple capacitance, GND pattern of width and leading line must be considered.
Please put into the capacitor between VCC pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late.
Please confirm sufficiently for the point.
The recommended parameter range for RL is 2kΩ~1MΩ. There are many factors (board layout, etc) that can affect characteristics.
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