ICS309 Integrated Circuit System, ICS309 Datasheet - Page 7

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ICS309

Manufacturer Part Number
ICS309
Description
Manufacturer
Integrated Circuit System
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ICS309RLF
Manufacturer:
NXP
Quantity:
490
MDS 309 A
Int egrat ed C ircuit Syst ems
AC Electrical Characteristics
Thermal Characteristics
VDD = 3.3V +/-10%
Note 1: Measured with 15 pF load.
Output High Voltage
Output Low Voltage
Output High Voltage,
CMOS level
Short Circuit Current
Input Capacitance
Internal pull-down resistor
Internal Pull-up Resistor
Input Frequency
Output Frequency
Output Clock Rise Time
Output Clock Fall Time
Output Clock Duty Cycle
Power-up time
Maximum Output Jitter, short term
Maximum Output Jitter, short term
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
P r e l i m i n a r y I n f o r m a t i o n
Parameter
Parameter
Parameter
52 5 Race Str eet, San Jose, C A 9 5126
, Ambient Temperature 0 to +70 C, unless stated otherwise
Symbol
V
V
R
R
V
C
OH
OH
OL
PD
PU
IN
Symbol
I
I
I
CLK outputs
PDTS pin
CLK outputs
PDTS pin
t
F
t
Symbol
OH
OL
OH
OR
OF
t
t
IN
j
j
= 8 mA
= -8 mA
= -4 mA
7
JA
JA
JA
JC
Conditions
Fundamental crystal
Input Clock
VDD=3.3V
0.8 to 2.0 V, Note 1
2.0 to 8.0 V, Note 1
STROBE goes high until
stable CLK out
PDTS goes high until
stable CLK out
Reference Clock
All other clocks, C
Configuration dependent
Still air
1 m/s air flow
3 m/s air flow
Conditions
Conditions
S
ERIAL
P
L
=15pF
VDD-0.4
ROGRAMMABLE
tel ( 408) 295- 9800
Min.
2.4
Min.
Min.
0.25
45
5
2
Typ.
+70
525
250
4
49-51
Typ.
±300
±200
Typ.
135
0.8
0.8
93
78
60
3
8
T
RIPLE
Max.
w w w.i c s t .c o m
0.4
Max. Units
Revision 053003
Max.
200
27
50
55
10
20
SS C
ICS309
Units
Units
LOCK
mA
C/W
C/W
C/W
C/W
k
k
MHz
MHz
MHz
pF
V
V
V
ms
ms
ns
ns
ps
ps
%

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