sp3012 Littelfuse, Inc., sp3012 Datasheet - Page 4

• Manufacturer Part Number: sp3012
• Description: 0.5pf Rail Clamp Array
• Manufacturer: Littelfuse, Inc.

©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
TVS Diode Arrays
Low Capacitance ESD Protection - SP3012 Series
Seating
Plane
Embossed Carrier Tape & Reel Specification — µDFN-10
Package Dimensions — µDFN-10 (2.5x1.0x0.5mm)
0.05 C
Z (C) G
C
www.littelfuse.com/SPA
A
L
Soldering Pad Layout
P1
P2
A0
D1
Recomended
Bottom View
P
e
Side View
P0
R0.125
b
0.10
P1
0.05
Top View
D
2xR0.075mm (7x)
M
M
for current information.
C A
C
b1
(SPA
5º Max
B
A1
Y
E
™
(Y1)
B
A
Family of Products)
A3
0.05 C
5º Max
T
Revision: August 17, 2011
197
Symbol
Soldering Pad Layout Dimensions
P1
X1
Y1
G
A1
A3
C
P
X
Y
Z
b1
A
D
b
E
e
L
Package
Symbol
A0
B0
D0
D1
K0
P0
P1
P2
W
E
T
F
(0.034)
(0.061)
0.008
0.020
0.039
0.008
0.027
0.061
0.016
Min
0.48
0.00
0.15
0.35
2.40
0.90
0.30
Inch
µDFN-10 (2.5x1.0x0.5mm)
Millimeters
0.125 Ref
0.50 BSC
µDFN-10 (2.5x1.0x0.5mm)
0.365
Nom
0.515
8.00 + 0.30 /- 0.10
0.20
0.40
2.50
1.00
Millimeter
--
0.254 +/- 0.02
Ø 1.50 + 0.10
Ø 1.00 + 0.25
(0.875)
1.30 +/- 0.10
2.83 +/- 0.10
3.50 +/- 0.05
0.65 +/- 0.10
4.00 +/- 0.10
4.00 +/- 0.10
2.00 +/- 0.05
1.75 +/- 0.10
0.675
Millimeters
(1.55)
0.20
0.50
0.20
0.40
1.00
1.55
Seating
Plane
Max
0.55
0.05
0.25
0.45
2.60
0.43
1.10
0.05 C
Z (C) G
C
Z (C) G
A
L
X
Soldering Pad Layout
Soldering Pad Layout
0.000
X
0.019
0.006
0.014
0.094
0.035
0.012
Min
Recomended
Bottom View
Alternative
e
P
Side View
P
R0.125
0.020 BSC
P1
b
0.10
0.05
0.005 Ref
Top View
P1
Inches
D
2xR0.075mm (7x)
0.020
0.008
0.098
0.039
Nom
0.016
0.014
X1
M
M
X1
C A
C
SP3012 Series
b1
B
0.021
0.022
0.043
0.012
0.018
0.102
0.016
Max
A1
Y
Y
E
(Y1)
(Y1)
B
A
A3
0.05 C