2n3906rlrp ON Semiconductor, 2n3906rlrp Datasheet

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2n3906rlrp

Manufacturer Part Number
2n3906rlrp
Description
Small Signal General Purpose Pnp Transistor
Manufacturer
ON Semiconductor
Datasheet

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2n3906rlrpG
Manufacturer:
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Quantity:
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2N3906
General Purpose
Transistors
PNP Silicon
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates Data in addition to JEDEC Requirements.
*For additional information on our Pb−Free strategy and soldering details, please
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 3
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Collector − Emitter Voltage
Collector − Base Voltage
Emitter − Base Voltage
Collector Current − Continuous
Total Device Dissipation @ T
Total Power Dissipation @ T
Total Device Dissipation @ T
Operating and Storage Junction
Temperature Range
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Pb−Free Packages are Available*
Derate above 25°C
Derate above 25°C
Characteristic
Rating
A
A
C
Preferred Device
= 60°C
= 25°C
= 25°C
(Note 1)
Symbol
Symbol
T
V
V
V
R
R
J
P
P
P
CEO
CBO
EBO
, T
I
qJA
qJC
C
D
D
D
stg
−55 to +150
Value
Max
83.3
200
625
250
200
5.0
5.0
1.5
40
40
12
1
mW/°C
mW/°C
mAdc
°C/W
°C/W
Unit
Unit
Vdc
Vdc
Vdc
mW
mW
°C
W
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
CASE 29
STYLE 1
TO−92
(Note: Microdot may be in either location)
ORDERING INFORMATION
A
L
Y
W
G
STRAIGHT LEAD
MARKING DIAGRAM
BASE
http://onsemi.com
BULK PACK
1 2
2
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
3
ALYWG
COLLECTOR
3906
2N
EMITTER
Publication Order Number:
G
3
1
TAPE & REEL
AMMO PACK
BENT LEAD
1
2
3
2N3906/D

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2n3906rlrp Summary of contents

Page 1

... Recommended Operating Conditions may affect device reliability. 1. Indicates Data in addition to JEDEC Requirements. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007 March, 2007 − Rev. 3 ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (Note 2) Collector −Base Breakdown Voltage Emitter −Base Breakdown Voltage Base Cutoff Current Collector Cutoff Current ON CHARACTERISTICS (Note 2) DC Current Gain Collector −Emitter Saturation Voltage Base −Emitter Saturation Voltage ...

Page 3

... Tape and Reel Packaging Specifications Brochure, BRD8011/D. +0.5 V 10.6 V Figure 1. Delay and Rise Time Equivalent Test Circuit < 500 ms 10 < t ...

Page 4

TYPICAL TRANSIENT CHARACTERISTICS 10 7.0 C 5.0 obo C ibo 3.0 2.0 1.0 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 REVERSE BIAS (VOLTS) Figure 3. Capacitance 500 300 200 100 ...

Page 5

TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS (V CE 5.0 SOURCE RESISTANCE = 200 1 4.0 SOURCE RESISTANCE = 200 0 3.0 SOURCE RESISTANCE = 2 2.0 ...

Page 6

TYPICAL STATIC CHARACTERISTICS 2.0 1.0 0.7 0.5 0.3 0.2 0.1 0.1 0.2 0.3 0.5 0.7 1.0 1 0.6 0.4 0.2 0 0.01 0.02 0.03 0.05 0.07 1 25° ...

Page 7

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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