2n2484ub1 STMicroelectronics, 2n2484ub1 Datasheet
2n2484ub1
Related parts for 2n2484ub1
2n2484ub1 Summary of contents
Page 1
... It complies with the ESCC 5000 qualification standard ESCC qualified according to the 5201-001 specification. In case of conflict between this datasheet and ESCC detailed specification, the latter prevails. Table 1. Device summary Order codes ESCC Part number 2N2484UB1 - 2N2484UB06 5201/001/06 2N2484UB07 5201/001/07 SOC2484 - SOC2484HRB ...
Page 2
... CEO V Emitter-base voltage (I EBO I Collector current C Total dissipation at T 2N2484HR 2N2484UB1 / SOC2484HRB P TOT 2N2484UB1 / SOC2484HRB Total dissipation at T for 2N2484HR T Storage temperature STG T Max. operating junction temperature J 1. When mounted 0.6 mm ceramic substrate. Table 3. Thermal data for through-hole package ...
Page 3
Electrical characteristics °C unless otherwise specified. case Table 5. Electrical characteristics Symbol Parameter Collector-base V (BR)CBO breakdown voltage Collector-emitter (2) V (BR)CEO breakdown voltage Emitter-base breakdown V (BR)EBO voltage Collector-base cut-off I CBO current Emitter-base ...
Page 4
Electrical characteristics Table 5. Electrical characteristics Symbol Parameter Spot noise figure Measurement performed on a sample basis, LTPD 7 or less. 2. Pulse measurement: Pulse width ≤ 300 µs, duty cycle ≤ 1.0 ...
Page 5
Test circuit Figure 2. Circuit for electrical measurements Table 7. List of components Component C1, C2 For optimum performance, C3 should be mounted as close as possible to the ...
Page 6
Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available ...
Page 7
Dim LCC-3UB mechanical data mm. Min. Typ. 1.16 0.46 0.51 0.56 0.76 0.92 1.02 1.95 2.03 2.92 3.05 2.41 2.54 0.42 0.57 1.37 1.52 ...
Page 8
Package mechanical data Dim 8/12 LCC-3 mechanical data mm. Min. Typ. 1.16 0.45 0.50 0.60 0.76 0.91 1.01 1.95 2.03 2.92 3.05 2.41 2.54 0.42 0.57 1.37 ...
Page 9
Doc ID 17734 Rev 1 Package mechanical data 9/12 ...
Page 10
... LCC-3UB Gold LCC-3UB Solder Dip LCC-3 Gold (1) LCC-3 Gold or Solder Dip (1) TO-18 Gold or Solder Dip Doc ID 17734 Rev 1 2N2484HR Marking EPPL Packing 2N2484UB1 - Waffle pack 520100106 - Waffle pack 520100107 - Waffle pack SOC2484 - Waffle pack 520100101 Waffle pack 520100104 Strip pack ...
Page 11
Revision history Table 9. Document revision history Date 09-Jul-2010 Revision 1 Initial release Doc ID 17734 Rev 1 Revision history Changes 11/12 ...
Page 12
... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...