bsc032ne2ls Infineon Technologies Corporation, bsc032ne2ls Datasheet - Page 3

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bsc032ne2ls

Manufacturer Part Number
bsc032ne2ls
Description
N-channel Power Mosfet
Manufacturer
Infineon Technologies Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSC032NE2LS
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
2
at
Table 2
Parameter
Continuous drain current
Pulsed drain current
Avalanche current, single pulse
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2)
3) See figure 13 for more detailed information
3
Table 3
Parameter
Thermal resistance, junction - case
Device on PCB
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
Final Data Sheet
T
PCB is vertical in still air.
PCB is vertical in still air
j
See figure 3 for more detailed information
= 25 °C, unless otherwise specified.
Maximum ratings
Maximum ratings
Thermal characteristics
Thermal characteristics
2)
3)
Symbol
R
R
Symbol
I
I
I
E
V
P
T
D
D,pulse
AS
thJC
thJA
j
AS
GS
tot
,T
stg
Min.
-
-
-
Min.
-
-
-
-
-
-
-
-
-20
-
-
-55
55/150/56
2
Typ.
-
-
-
Typ. Max.
-
-
-
-
-
-
-
-
-
-
-
-
2
2
Values
(one layer, 70 µm thick) copper area for drain connection.
Values
(one layer, 70 µm thick) copper area for drain connection.
84
53
68
43
22
336
45
20
20
37
2.5
150
Max.
3.4
20
50
OptiMOS™ Power-MOSFET
Unit
A
mJ
V
W
°C
Unit
K/W
Note / Test Condition
V
V
V
V
V
R
T
I
T
T
D
C
C
A
GS
GS
GS
GS
GS
thJA
=20 A,R
=25 °C
=25 °C
=25 °C, R
=10 V, T
=10 V, T
=4.5 V, T
=4.5 V, T
=10 V, T
Note /
Test Condition
top
6 cm
=50 K/W
BSC032NE2LS
2
GS
2.1, 2011-09-20
cooling area
=25 Ω
thJA
C
C
A
C
C
=25 °C
=100 °C
=25 °C,
1)
=25 °C
=100 °C
)
=50 K/W
1)
1)
)

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