74LVC08AD,112 NXP Semiconductors, 74LVC08AD,112 Datasheet - Page 16

• Manufacturer Part Number: 74LVC08AD,112
• Description: IC QUAD 2-IN AND GATE 14SOIC
• Manufacturer: NXP Semiconductors
• Series: 74LVCr

Specifications of 74LVC08AD,112

• Logic Type: AND Gate
• Number Of Inputs: 2
• Number Of Circuits: 4
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Logic Family: LVC
• Logical Function: AND
• Number Of Elements: 4
• High Level Output Current: -24mA
• Low Level Output Current: 24mA
• Propagation Delay Time: 5.5ns
• Operating Supply Voltage (typ): 1.8/2.5/3.3V
• Operating Temp Range: -40C to 125C
• Package Type: SO
• Number Of Outputs: 1
• Technology: CMOS
• Mounting: Surface Mount
• Pin Count: 14
• Operating Temperature Classification: Automotive
• Quiescent Current: 40uA
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.2V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74LVC08AD; 74LVC08AD; 935250020112

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
2003 Feb 24
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
Quad 2-input AND gate
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(4)
, SO, SOJ
PACKAGE
(1)
16
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(3)
SOLDERING METHOD
(4)(5)
(6)
suitable
suitable
suitable
suitable
suitable
Product specification
74LVC08A
REFLOW
(2)