74HC02D,653 NXP Semiconductors, 74HC02D,653 Datasheet
74HC02D,653
Specifications of 74HC02D,653
74HC02D-T
933714150653
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74HC02D,653 Summary of contents
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Quad 2-input NOR gate Rev. 03 — 18 September 2008 1. General description The 74HC02; 74HCT02 are high-speed Si-gate CMOS devices that comply with JEDEC standard no. 7A. They are pin compatible with Low-power Schottky TTL (LSTTL). The ...
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... NXP Semiconductors 4. Functional diagram mna216 Fig 1. Logic symbol 5. Pinning information 5.1 Pinning GND Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 5.2 Pin description Table 2. Pin description Symbol Pin 10 9,12 GND 74HC_HCT02_3 Product data sheet 001aah084 Fig 2. IEC logic symbol 001aac919 Fig 5 ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Input [ HIGH voltage level LOW voltage level don’t care. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage ...
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... NXP Semiconductors Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74HC02 V HIGH-level V = 2.0 V ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74HCT02 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage 4 LOW-level output voltage 5.2 mA input leakage current supply current 6 additional per input pin; ...
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... NXP Semiconductors Table 7. Dynamic characteristics GND = pF; for load circuit see L Symbol Parameter Conditions 74HCT02 t propagation delay nA nY; see transition time power dissipation per package; PD capacitance V = GND [ the same as t and PHL PLH [ the same as t and THL TLH [ used to determine the dynamic power dissipation (P ...
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... NXP Semiconductors Test data is given in Table Definitions test circuit termination resistance should be equal to output impedance load capacitance including jig and probe capacitance. L Fig 7. Load circuitry for measuring switching times Table 9. Test data Type Input V I 74HC02 V CC 74HCT02 3.0 V 74HC_HCT02_3 Product data sheet ...
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... NXP Semiconductors 12. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.01 0.069 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 10. Package outline SOT337-1 (SSOP14) ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added type numbers 74HC02BQ and 74HCT02BQ (DHVQFN14 package) ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 Revision history ...