ammp-6442 Avago Technologies, ammp-6442 Datasheet - Page 8

• Manufacturer Part Number: ammp-6442
• Description: 37- 40 Ghz, 1w Linear Power Amplifier In Smt Package
• Manufacturer: Avago Technologies

Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
x Apply solder paste using a stencil printer or dot
x Follow solder paste and vendor’s recommendations
x Packages have been qualified to withstand a peak
Figure 15. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
8
Please see recommended solder reflow profile. Neither
Conductive epoxy or hand soldering is recommended.
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
temperature of 260qC for 20 seconds. Verify that the
profile will not expose device beyond these limits.
300
250
200
150
100
50
0
0
Ramp 1 Preheat Ramp 2
50
Peak = 250 ± 5°C
100
Seconds
150
Reow
Melting point = 218°C
200
Cooling
250
300
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 14b. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is accom-
plished in a belt furnace using convection heat transfer.
The suggested reflow profile for automated reflow
processes is shown in Figure 15. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 1 will vary among different solder
pastes from different manufacturers and is shown here for
reference only.
AMMP-64xx Part Number Ordering Information
Part Number
AMMP-64xx-BLK
AMMP-64xx-TR1
AMMP-64xx-TR2
Devices Per
Container
10
100
500
Container
Antistatic bag
7” Reel
7” Reel