eclamp3343c Semtech Corporation, eclamp3343c Datasheet
eclamp3343c
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eclamp3343c Summary of contents
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... USB 2.0 Upstream Ports (Low and Full Speed) USB 2.0 Downstream Ports (Low and Full Speed) Cellular Handsets Set Top Box Portable Electronics PC Peripherals Schematic & PIN Configuration A1 (VBus) 5.25V B1,B3 A4 (ID) 11-Bump Flip Chip TVS (Top/Ball Down View) B1,B3 1 EClamp3343C ), ID, and data BUS and 3.3V BUS ...
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... EClamp3343C > > ...
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... Reverse Voltage - V Normalized Pull Up Resistance vs. Temperature 1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0.96 -40 - Temperature (*C ) 2004 Semtech Corp. Normalized Series Resistance vs. Temperature 1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0. MHz - (V) R Normalized Pull Down Resistance vs. Temperature 1.04 1.02 1 0.98 0.96 - EClamp3343C ESD Clamping (-8kV Contact) - Temperature (* Temperature (*C ) www.semtech.com 85 85 ...
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... PROTECTION PRODUCTS Applications Information The EClamp3343C is designed for termination and ESD/EMI protection of USB ports operating to 12Mb/s. This includes USB 1.1, USB 2.0 (low and full speed options) and USB OTG. The device includes the necessary pull up and pull down resistors to configure standard USB ports for either upstream or down stream configuration ...
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... Gnd Figure 6. USB Upstream Schematic (Low Speed) A2 (D-) B1,B3 (Gnd) A3 (D+) A1 (VBus) B1,B3 (Gnd) 5.25V Figure 7. USB Upstream Layout (Low Speed) B1,B3 (Gnd) A4 VBus (NC) Vtrm Gnd B1,B3 (Gnd Gnd 5 EClamp3343C VBus (Vtrm) 3.3V Rup 1. (D-) (VBus) 5.25V 15K RPd1 B1,B3 (Gnd) B1,B3 B2 (NC) (Gnd (NC) (D+) ...
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... Figure 8. USB Downstream Schematic C1 (NC) Rup 1. (D+) (D+) 15K RPd1 B1,B3 (Gnd) B1,B3 (Gnd) B2 (Gnd (D-) (D-) 15K Rpd2 B1,B3 (Gnd) B1,B3 (Gnd) C4 (Gnd) Figure 9. USB Downstream Layout VBus D+ D- Gnd 2004 Semtech Corp. A1 (VBus) 5.25V B1,B3 (Gnd) A4 (NC) B1,B3 (Gnd) VBus EClamp3343C www.semtech.com ...
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... IPC/JEDEC standard J-STD-020 for assembly of small body components. During reflow, the component will self-align itself on the pad. 2004 Semtech Corp. EClamp3343C Recommended NSMD Pad and Stencil Aperture Assembly Guideline for Pb-Free Soldering The following are recommendations for the assembly ...
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... Sn63/Pb37 FOR STANDARD DEVICES OR Sn95.5/Ag3.8/Cu0.7 FOR Pb-FREE DEVICES. 0.50 0.25 11X Ø0.275 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 8 EClamp3343C 0.50-0.75 0.250±0.025 11X Ø.315±0.020 0. 0.43 www.semtech.com ...
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... EMIClamp and EClamp are marks of Semtech Corporation Tape Specifications Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 9 EClamp3343C ...