sigc28t60s Infineon Technologies Corporation, sigc28t60s Datasheet
sigc28t60s
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sigc28t60s Summary of contents
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... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC28T60S G Package Ordering Code Q67050- sawn on foil A4392-A101 6. ...
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... Symbol Conditions 50A , SIGC28T60S Value 600 1 ) 150 20 -40 ... +175 Value min. typ. max. = 4mA 600 C =50A 1.5 2. 4.1 4.9 5 =0V 2.6 ...
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... CHIP DRAWING: Edited by INFINEON Technologies CLS, L7561D, Edition 2, 26.01.2005 SIGC28T60S ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies CLS, L7561D, Edition 2, 26.01.2005 SIGC28T60S IKW50N60T ...