wm2000 Wolfson Microelectronics plc, wm2000 Datasheet - Page 5

• Manufacturer Part Number: wm2000
• Description: Handset Receiver Speaker Driver With Wolfson Myzone Ambient Noise Cancellation
• Manufacturer: Wolfson Microelectronics plc

Pre-Production
w
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
PACKAGE DIMENSIONS
2
Symbols
B: 25 BALL W-CSP PACKAGE 2.552
g
DETAIL 2
D1
E1
A1
A2
f2
f1
D
E
h
e
g
A
A2
A
0.291 BSC
0.266 BSC
0.615
0.225
0.355
0.035
MIN
A
B
C
D
E
1
5
bbb
Z
2.552 BSC
2.602 BSC
0.314 BSC
2.00 BSC
2.00 BSC
0.50 BSC
Dimensions (mm)
Z
0.250
0.380
NOM
0.070
0.7
4
BOTTOM VIEW
A1
e
3
D1
0.785
0.275
0.405
0.105
X
MAX
2
2.602
DETAIL 2
1
X
DETAIL 1
0.7mm BODY, 0.50 mm BALL PITCH
NOTE
e
5
5
E1
4
2 X
2 X
A1
CORNER
0.10
0.10
Z
Z
TOP VIEW
f1
6
D
SOLDER BALL
h
f2
DETAIL 1
PP, July 2009, Rev 3.0
DM056.A
E
WM2000
5