msm7664 Oki Semiconductor, msm7664 Datasheet - Page 75

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msm7664

Manufacturer Part Number
msm7664
Description
Ntsc/pal Digital Video Decoder
Manufacturer
Oki Semiconductor
Datasheet

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PACKAGE DIMENSIONS
¡ Semiconductor
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
TQFP100-P-1414-0.50-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
PEDL7664-01
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.55 TYP.
(Unit : mm)
MSM7664
75/76

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