le79r241 Zarlink Semiconductor, le79r241 Datasheet - Page 25
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le79r241
Manufacturer Part Number
le79r241
Description
Intelligent Subscriber Line Interface Circuit
Manufacturer
Zarlink Semiconductor
Datasheet
1.LE79R241.pdf
(27 pages)
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REVISION HISTORY
Revision H to Revision I
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Revision I to Revision J
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Revision J to K
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Revision K to L
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Page 11, Figure 3, DT1i was added and the last note was modified.
Page 12, Figure 4, DT1i was added and the last note was modified.
Page 15, Electrical Characteristics, Numbers changed in the Max column.
Page 16, Absolute Maximum Ratings, The “Humidity” row was deleted.
Page 17, Specifications, There were changes to rows one, four, six, 12, and 17–21, and to the Note column.
Page 18, Relay Driver Specifications, There were changes in the last two rows.
Page 19, Transmission Specifications, There were changes to rows, six, eight, 10, and 13, and to the Note column.
Page 20, Fault Indications, “ILG operates normally” was deleted from the Indication column on the second row.
Applied new format.
Global change: RTMG1 to RMGLi, and RTMG2 to RMGPi.
Updated “Target Specifications” for rows 10, and 19.
Updated “Transmission Specifications” for row 12.
“Thermal Management Equations” modified.
Added “Applications” section.
Added 5 REN bullet to Features.
Updated Device Internal Block Diagram.
Modified description of LD pin.
In "Thermal Resistance" section, updated temperature to 43
New Temperature statement added to “Chipset Features".
New Temperature statement added to “Environmental Ranges".
Removed reference to V
“Waveforms,” new image.
In "DC Specificaitons" section, the following changes were made:
–
–
–
“DC Specifications,” “Transmission Specifications,” and “Line Card Parts List,” corrected W’s to omega’s.
Added typical value for Ringing Specifications.
Renamed "Fault Indications" table to "Thermal Shutdown Fault Indications"; modified text.
Modified text in "Operating Modes" section.
“Thermal-Management Equations,” corrected “P
“Application Circuits,” added line to arrow head at DT1i, and deleted “H” from R2 and R3.
Modified note for External Ringing Line card schematic.
Added QFN package data to “Connection Diagram,” “Absolute Maximum Ratings,” and “Physical Dimensions.”
Updated "Am" OPNs (Ordering Part Numbers) to "Le" throughout document
In "Ordering Information" the following changes were made:
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–
–
In "Features," added bullet for space savings feature
Removed references to DISLAC documents in "Related Literature"
In "Pin Descriptions," added row describing exposed pad
Standardized notes in "Absolute Maximum Ratings" section
Added test conditions for two-wire loop voltage.
Added a typical value for Ternary input voltage, Mid boundary.
Removed references to T
Added entries for Le79R241JC and Le79R241QC
Removed the chip graphic
Added notes
LOOPMAX
A
under test conditions for idle channel noise.
in the "Electrical Ranges" section.
Zarlink Semiconductor Inc.
TMG
” to “PT
25
RTMG
°
C.
” and corrected “(R
L
I
L
)” to “(R
F
+ R
L
)I
L
.”