se2545a23 SiGe Semiconductor, se2545a23 Datasheet - Page 16

• Manufacturer Part Number: se2545a23
• Description: Dual Band 802.11n Wireless Lan Front End
• Manufacturer: SiGe Semiconductor

Package Information
Figure 13, Figure 14 and Figure 15 are the detailed device package diagrams. The pads on the SiGe RF modules
are plated with gold over nickel, with a gold thickness of approx. 0.75 to 1.0 um. The modules can be reflowed onto
FR4 based material using eutectic Pb based or common tin based Pb free solder pastes.
218-DST-01 Rev 1.1 Aug-31-2006
2X
14.00 ±0.10
2X
0.15 C
(TYP)
3.00
0.15 C
B
10
11
12
13
14
1
2
3
4
5
6
7
8
9
Figure 13: SE2545A23 Package Diagram (218-POD-01, Rev 2.0)
GND
GND
48
15
GND
GND
47
16
SEE NOTE 3
GND
GND
GND
GND
GND
GND
46
17
GND
GND
45
18
10.00 ±0.10
GND
GND
GND
GND
GND
GND
44
19
GND
GND
43
20
GND
GND
42
21
Dual Band 802.11n Wireless LAN Front End
GND
GND
41
22
GND
GND
GND
GND
GND
GND
40
23
GND
GND
39
24
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A
Preliminary Information
0.10 C
SE2545A23
1.10 ±0.10
C
0.08 C
PLANE
SEATING
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