s71vs064rb0 Meet Spansion Inc., s71vs064rb0 Datasheet - Page 15

• Manufacturer Part Number: s71vs064rb0
• Description: Mirrorbit 1.8 Volt-only Simultaneous Read/write, Burst Mode Multiplexed Flash Memory And Burst Mode Psram
• Manufacturer: Meet Spansion Inc.

January 26, 2009 S71VS_XS-R_00_05
PACKAGE
SYMBOL
SE / SD
JEDEC
D x E
Ø b
MD
ME
A1
A2
D1
E1
A
D
E
n
e
0.80
0.18
0.62
0.25
MIN
3A,3F,4A,4F,7A,7F,8A,8F
7.50 mm x 5.00 mm
PACKAGE
7.50 BSC
5.00 BSC
4.50 BSC
2.50 BSC
0.50 BSC
0.25 BSC
RSB 052
NOM
0.30
N/A
---
---
---
10
52
6
S71VS/XS-R Memory Subsystem Solutions
D a t a
MAX
1.00
0.77
0.35
Figure 4.7 RSB052—52-ball VFBGA 5.0 x 7.5 mm
---
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
DEPOPULATED SOLDER BALLS
S h e e t
NOTE
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3711 \ 16-038.63 \ 10.24.8
15