k4t56043qf Samsung Semiconductor, Inc., k4t56043qf Datasheet - Page 7

• Manufacturer Part Number: k4t56043qf
• Description: 256mb F-die Ddr2 Sdram Specification
• Manufacturer: Samsung Semiconductor, Inc.

256Mb F-die DDR2 SDRAM
2. Package Pinout/Mechnical Dimension & Addressing
2.1 Package Pinout
Notes:
B1, B9, D1, D9 = NC for x4 organization.
Pins B3 has identical capacitance as pins B7.
VDDL and VSSDL are power and ground for the DLL. It is recommended that they are isolated on the device from
VDD, VDDQ, VSS, and VSSQ.
Ball Locations (x4)
x4 package pinout (Top View) : 60ball FBGA Package
VDDQ
VDD
VDDL
VDD
NC
VSS
NC
NC
1
G
A
B
C
D
E
H
K
F
J
L
Top View (See the balls through the Package)
+
+
+
+
VSSQ
DQ1
VSSQ
VREF
1
CKE
BA0
A10
A12
NC
A3
A7
2
2
+ : Depopulated Ball
VDDQ
: Populated Ball
VSS
DQ3
VSS
BA1
DM
WE
NC
3
A1
A5
A9
3
+
+
+
+
+
+
+
+
+
+
+
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4
A
B
C
D
G
H
K
E
F
L
J
+
+
+
+
+
+
+
+
+
+
+
5
VSSDL
VDDQ
VSSQ
DQ2
DQS
RAS
CAS
A11
+
+
+
+
+
+
+
+
+
+
+
NC
A2
A6
6
7
7
VSSQ
VSSQ
DQS
DQ0
CK
CK
NC
CS
A0
A4
A8
8
8
+
VDDQ
+
+
VDDQ
VDD
ODT
VSS
9
VDD
NC
NC
9
Rev. 0.91 (Sep. 2003)
DDR2 SDRAM
Preliminary