hb28d032bp2 Renesas Electronics Corporation., hb28d032bp2 Datasheet - Page 88

• Manufacturer Part Number: hb28d032bp2
• Description: Mobile Embedded Flash With Multimediacard-tm Interface 16 Mbyte/32 Mbyte
• Manufacturer: Renesas Electronics Corporation.

HB28E016/D032BP2
Physical Outline (HB28E016BP2)
88
0.20 S B
S
0.10
INDEX
S
4
9.00
0.20
0.15
S
Datum A, B are defined as center lines of ball matrix.
Sn-Ag-Cu alloy were used for ball material on BP-71AV.
A
A
Hitachi Code
JEDEC Code
EIAJ Code
Mass (reference value)
0.80
H
71
Details of the part A
G
0.08
0.45
F
M
E
S
D
0.05
A B
B
C
1.70
BP-71AV
—
—
—
B
A
12
11
10
9
8
7
6
5
4
3
2
1
Unit: mm