mt18htf25672py-80e Micron Semiconductor Products, mt18htf25672py-80e Datasheet

mt18htf25672py-80e

Manufacturer Part Number

mt18htf25672py-80e

Description

512mb, 1gb, 2gb X72, Ecc, Sr 240-pin Ddr2 Sdram Rdimm

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT18HTF25672PY-80E.pdf (18 pages)

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DDR2 SDRAM Registered DIMM (RDIMM)

MT18HTF6472 – 512MB

MT18HTF12872(P) – 1GB

MT18HTF25672(P) – 2GB

For component data sheets, refer to Micron's Web site:

Features

• 240-pin, registered dual in-line memory module

• Fast data transfer rates: PC2-3200, PC2-4200, PC2-

• Supports ECC error detection and correction

• V

• JEDEC-standard 1.8V I/O (SSTL_18-compatible)

• Differential data strobe (DQS, DQS#) option

• 4n-bit prefetch architecture

• Single rank

• Multiple internal device banks for concurrent

• Programmable CAS# latency (CL)

• Posted CAS# additive latency (AL)

• WRITE latency = READ latency - 1

• Programmable burst lengths: 4 or 8

• Adjustable data-output drive strength

• 64ms, 8,192-cycle refresh

• On-die termination (ODT)

• Serial presence-detect (SPD) with EEPROM

• Gold edge contacts

Table 1:

PDF: 09005aef80e5e752/Source: 09005aef80e5e626

HTF18C64_128_256x72.fm - Rev. E 3/07 EN

5300, or PC2-6400

operation

DDSPD

Speed

Grade

-80E

-800

-667

-53E

-40E

= V

= +1.7V to +3.6V

Q = +1.8V

Key Timing Parameters

Products and specifications discussed herein are subject to change by Micron without notice.

Nomenclature

PC2-6400

Industry

PC2-6400

PC2-5300

PC2-4200

PC2-3200

512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM

CL = 6

800

–

CL = 5

Data Rate (MT/s)

667

800

667

–

www.micron.com

CL = 4

Figure 1:

Notes: 1. Contact Micron for industrial temperature

Options

• Parity

• Operating temperature

• Package

• Frequency/CAS latency

• PCB height

533

400

PCB height: 30mm (1.18in)

– Commercial (0°C ≤ T

– Industrial (–40°C ≤ T

– 240-pin DIMM (Pb-free)

– 2.5ns @CL = 5 (DDR2-800)

– 2.5ns @ CL = 6 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

– 3.75ns @ CL = 4 (DDR2-533)

– 5.0ns @ CL = 3 (DDR2-400)

– 30mm (1.18in)

Micron Technology, Inc., reserves the right to change products or specifications without notice.

2. CL = CAS (READ) latency; registered mode

3. Not available in 512MB density.

module offerings.

will add one clock cycle to CL.

CL = 3

400

–

240-Pin RDIMM (MO-237

R/C C–Non-Parity, R/C H–Parity)

(ns)

12.5

RCD

≤ +85°C)

≤ +70°C)

(ns)

12.5

Marking

Features

None

-80E

-53E

-40E

-800

-667

(ns)

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