mt18lsdt3272g-10e Micron Semiconductor Products, mt18lsdt3272g-10e Datasheet - Page 9

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mt18lsdt3272g-10e

Manufacturer Part Number
mt18lsdt3272g-10e
Description
256mb, 512mb, 1gb X72, Ecc, Sr 168-pin Sdram Rdimm
Manufacturer
Micron Semiconductor Products
Datasheet
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Table 10:
Table 11:
Table 12:
PDF: 09005aef809b161a/Source: 09005aef809b15eb
SD18C32_64_128x72.fm - Rev. E 1/08 EN
Parameter/Condition
Parameter/Condition
Parameter/Condition
Operating current: Active mode; BL = 2; Read or write;
Standby current: Power-down mode; All device banks idle; CKE = LOW
Standby current: Active mode; CKE = HIGH; CS# = HIGH; All device banks
active after
Operating current: Burst mode; Page burst; Read or write; All device banks
active
Auto refresh current: CS# = HIGH; CKE = HIGH
Self refresh current: CKE ≤ 0.2V
Operating current: Active mode; BL = 2; Read or write;
Standby current: Power-down mode; All device banks idle; CKE = LOW
Standby current: Active mode; CKE = HIGH; CS# = HIGH; All device banks
active after
Operating current: Burst mode; Page burst; Read or write; All device banks
active
Auto refresh current: CS# = HIGH; CKE = HIGH
Self refresh current: CKE ≤ 0.2V
Operating current: Active mode; BL = 2; Read or write;
Standby current: Power-down mode; All device banks idle; CKE = LOW
Standby current: Active mode; CKE = HIGH; CS# = HIGH; All device banks
active after
Operating current: Burst mode; Page burst; Read or write; All device banks
active
Auto refresh current: CS# = HIGH; CKE = HIGH
Self refresh current: CKE ≤ 0.2V
DD
Specifications
t
t
t
RCD has been met; No accesses in progress
RCD has been met; No accesses in progress
RCD has been met; No accesses in progress
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Values are for the MT48LC32M4A2 SDRAM components only and are computed from values specified in the
128Mb (32 Meg x 4) component data sheet
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Values are for the MT48LC64M4A2 SDRAM components only and are computed from values specified in the
256Mb (64 Meg x 4) component data sheet
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Values are for the MT48LC128M4A2 SDRAM components only and are computed from values specified in the
512Mb (128 Meg x 4) component data sheet
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Specifications and Conditions – 256MB
Specifications and Conditions – 512MB
Specifications and Conditions – 1GB
256MB, 512MB, 1GB (x72, ECC, SR): 168-Pin SDRAM RDIMM
t
t
t
t
t
t
t
RC =
RC =
RC =
RFC =
RFC = 7.8125µs
RFC =
RFC = 7.8125µs
t
t
9
RFC =
RFC = 15.625µs
t
t
t
RC (MIN)
RC (MIN)
RC (MIN)
t
t
RFC (MIN)
RFC (MIN)
t
RFC (MIN)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
Symbol
Symbol
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I
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DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
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2
3
4
5
6
7
1
2
3
4
5
6
7
1
2
3
4
5
6
7
Electrical Specifications
2,160
2,250
4,410
2,880
2,970
5,940
2,430
2,430
5,130
-13E
-13E
-13E
810
108
108
900
720
©2003 Micron Technology, Inc. All rights reserved
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36
54
36
36
63
45
1,980
2,250
4,410
2,700
2,700
5,580
2,250
2,430
4,860
-133
-133
-133
810
108
108
900
720
63
36
54
36
36
63
45
Units
Units
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA

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