mt16hts25664hy-53e Micron Semiconductor Products, mt16hts25664hy-53e Datasheet - Page 8

• Manufacturer Part Number: mt16hts25664hy-53e
• Description: 2gb, 4gb X64, Dr 200-pin Ddr2 Sdram Sodimm
• Manufacturer: Micron Semiconductor Products

Table 9:
PDF: 09005aef821e5bf3/Source: 09005aef82198d54
HTS16C256_512x64H.fm - Rev. B 10/07 EN
Parameter/Condition
Operating one bank active-precharge current:
t
commands; Address bus inputs are switching; Data bus inputs are switching
Operating one bank active-read-precharge current: I
CL = CL (I
t
bus inputs are switching; Data pattern is same as I
Precharge power-down current: All device banks idle;
is LOW; Other control and address bus inputs are stable; Data bus inputs are
floating
Precharge quiet standby current: All device banks idle;
CKE is HIGH, S# is HIGH; Other control and address bus inputs are stable; Data
bus inputs are floating
Precharge standby current: All device banks idle;
HIGH, S# is HIGH; Other control and address bus inputs are switching; Data
bus inputs are switching
Active power-down current: All device banks open;
t
inputs are stable; Data bus inputs are floating
Active standby current: All device banks open;
t
commands; Other control and address bus inputs are switching; Data bus
inputs are switching
Operating burst write current: All device banks open; Continuous burst
writes; BL = 4, CL = CL (I
t
inputs are switching; Data bus inputs are switching
Operating burst read current: All device banks open; Continuous burst
read; I
t
commands; Address bus inputs are switching; Data bus inputs are switching
Burst refresh current:
t
control and address bus inputs are switching; Data bus inputs are switching
Self refresh current: CK and CK# at 0V; CKE ≤ 0.2V; Other control and
address bus inputs are floating; Data bus inputs are floating
Operating bank interleave read current: All device banks interleaving
reads; I
t
HIGH, S# is HIGH between valid commands; Address bus inputs are stable
during deselects; Data bus inputs are switching
RC =
RCD =
CK =
RAS =
RP =
RAS =
RFC (I
CK =
t
t
t
t
RP (I
OUT
DD
RC (I
CK (I
CK (I
t
t
t
OUT
RAS MAX (I
RAS MAX (I
RCD (I
) interval; CKE is HIGH, S# is HIGH between valid commands; Other
DD
= 0mA; BL = 4, CL = CL (I
DD
DD
DD
= 0mA; BL = 4, CL = CL (I
DD
), AL = 0;
); CKE is HIGH, S# is HIGH between valid commands; Address bus
),
DDR2 I
Values are shown for the MT47H256M8THJ DDR2 SDRAM only and are computed from values specified in the
2Gb TwinDie (256 Meg x 8) component data sheet
); CKE is LOW; Other control and address bus
),
DD
t
t
RAS =
RC =
); CKE is HIGH, S# is HIGH between valid commands; Address
DD
DD
t
t
),
),
CK =
DD
RC (I
t
RAS MIN (I
t
t
DD
RP =
RP =
t
CK =
Specifications and Conditions – 2GB
), AL = 0;
DD
t
CK (I
t
t
),
RP (I
RP (I
t
CK (I
t
RRD =
DD
DD
DD
DD
DD
),
DD
t
DD
); CKE is HIGH, S# is HIGH between valid
CK =
t
); CKE is HIGH, S# is HIGH between valid
); CKE is HIGH, S# is HIGH between valid
), AL = 0;
RC =
), AL =
); REFRESH command at every
t
RRD (I
t
CK (I
t
RC (I
t
DD
RCD (I
t
DD
CK =
),
DD
),
t
t
DD
RCD =
),
CK =
t
t
DD
RAS =
t
2GB, 4GB (x64, DR) 200-Pin DDR2 SDRAM SODIMM
CK =
t
4W
t
RAS =
CK =
CK (I
) - 1 ×
t
CK (I
t
t
t
RCD (I
OUT
CK =
DD
CK (I
t
t
t
CK (I
RAS MAX (I
t
CK =
RAS MIN (I
),
8
t
DD
CK (I
= 0mA; BL = 4,
DD
t
Fast PDN exit
MR[12] = 0
Slow PDN exit
MR[12] = 1
),
CK (I
DD
DD
t
),
CK (I
DD
); CKE is
); CKE is
DD
);
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
DD
DD
); CKE
);
),
),
Symbol
I
I
I
I
I
I
I
I
DD
DD
DD
DD
DD
DD
I
I
DD
DD
I
I
I
DD
DD
DD
DD
DD
3Pf
3Ps
4W
2Q
2N
3N
2P
4R
0
1
5
6
7
Electrical Specifications
1,176
1,176
1,816
2,336
-667
776
896
112
376
416
296
136
536
112
©2006 Micron Technology, Inc. All rights reserved.
1,096
1,096
1,776
2,256
-53E
656
856
112
376
416
296
136
456
112
1,736
2,176
-40E
656
816
112
336
376
296
136
416
936
936
112
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA