m464s3323bn0 Samsung Semiconductor, Inc., m464s3323bn0 Datasheet
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m464s3323bn0
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m464s3323bn0 Summary of contents
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... EEPROM in 8-pin TSSOP package on a 144-pin glass-epoxy substrate. Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The M464S3323BN0 is a Small Outline Dual In-line Memory Mod- ule and is intended for mounting into 144-pin edge connector sockets. ...
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... M464S3323BN0 PIN CONFIGURATION DESCRIPTION Pin Name CLK0~1 System clock CS0~1 Chip select CKE0~1 Clock enable A0 ~ A11 Address BA0 ~ BA1 Bank select address RAS Row address strobe CAS Column address strobe WE Write enable DQM0 ~ 7 Data input/output mask DQ0 ~ 63 Data input/output V /V Power supply/ground ...
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... M464S3323BN0 FUNCTIONAL BLOCK DIAGRAM CS1 CS0 DQM0 DQM CS DQ0 DQ0 DQ1 DQ1 DQ2 DQ2 U0 DQ3 DQ3 DQ4 DQ4 DQ5 DQ5 DQ6 DQ6 DQ7 DQ7 DQM1 DQM CS DQ8 DQ0 DQ9 DQ1 DQ10 DQ2 U1 DQ11 DQ3 DQ12 DQ4 DQ13 DQ5 DQ14 DQ6 DQ15 ...
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... M464S3323BN0 ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative to Vss Voltage on V supply relative to Vss DD Storage temperature Power dissipation Short circuit current Note : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. ...
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... M464S3323BN0 DC CHARACTERISTICS (Recommended operating condition unless otherwise noted, T Parameter Symbol Operating current I CC1 (One bank active CC2 Precharge standby current in power-down mode I PS CC2 I N CC2 Precharge standby current in non power-down mode I NS CC2 I P CC3 Active standby current in power-down mode ...
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... M464S3323BN0 AC OPERATING TEST CONDITIONS Parameter AC input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition 3.3V 1200 Output 50pF 870 (Fig output load circuit OPERATING AC PARAMETER (AC operating conditions unless otherwise noted) ...
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... M464S3323BN0 AC CHARACTERISTICS (AC operating conditions unless otherwise noted) REFER TO THE INDIVIDUAL COMPONENET, NOT THE WHOLE MODULE. Parameter CAS latency=3 CLK cycle time CAS latency=2 CAS latency=3 CLK to valid output delay CAS latency=2 CAS latency=3 Output data hold time CAS latency=2 CLK high pulse width ...
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... M464S3323BN0 SIMPLIFIED TRUTH TABLE Command Register Mode register set Auto refresh Entry Refresh Self refresh Exit Bank active & row addr. Auto precharge disable Read & column address Auto precharge enable Auto precharge disable Write & column address Auto precharge enable ...
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... M464S3323BN0 PACKAGE DIMENSIONS 0.16 0.039 (4.00 0.10) 1 0.13 (3.30) 0.15 (3.70) 2 0.150 Max (3.80 Max) 0.04 0.0039 (1.00 0.10) Tolerances : .006(.15) unless otherwise specified The used device is 16Mx8 SDRAM, sTSOP2 SDRAM Part No. : K4S280832B-N Shrink-TSOP 2.66 (67.56) 2.50 (63.60 0.91 1.29 (23.20) (32.80) 0.18 (4.60) 0.083 (2.10) 0.10 (2.50 0.16 0.0039 (4.00 0.10) 0.06 0.0039 (1.50 0.1) Detail Z 144pin SDRAM SODIMM Units : Inches (Millimeters) 2-R 0.078 Min (2.00 Min) 143 2- 0.07 (1.80) Y 144 ...