m368l3324dus-lcc Samsung Semiconductor, Inc., m368l3324dus-lcc Datasheet - Page 4

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m368l3324dus-lcc

Manufacturer Part Number
m368l3324dus-lcc
Description
Ddr Sdram Unbuffered Module
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
1.0 Ordering Information
2.0 Operating Frequencies
3.0 Feature
• V
• V
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe [DQ] (x4,x8) & [L(U)DQS] (x16)
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• Programmable Read latency : DDR333(2.5 Clock), DDR400(3 Clock)
• Programmable Burst length (2, 4, 8)
• Programmable Burst type (sequential & interleave)
• Edge aligned data output, center aligned data input
• Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
• Serial presence detect with EEPROM
• PCB : Height 1,250 (mil) & single (256, 512MB), double (1GB) sided
• SSTL_2 Interface
• 66pin TSOP II
256MB, 512MB, 1GB Unbuffered DIMM
RoHS compliant
DD
DD
: 2.5V ± 0.2V, V
: 2.6V ± 0.1V, V
M381L6523DUM-C(L)CC/B3
M381L2923DUM-C(L)CC/B3
M368L3324DUS-C(L)CC/B3
M368L6523DUS-C(L)CC/B3
M368L2923DUN-C(L)CC/B3
Speed @CL2.5
CL-tRCD-tRP
Speed @CL2
Speed @CL3
Part Number
Lead-Free
184Pin Unbuffered DIMM based on 512Mb D-die (x8, x16)
DDQ
DDQ
: 2.5V ± 0.2V for DDR333
: 2.6V ± 0.1V for DDR400
package
Density
256MB
512MB
512MB
1GB
1GB
CC(DDR400@CL=3)
166MHz
200MHz
3-3-3
-
Organization
128M x 64
128M x 72
2 of 23
32M x 64
64M x 64
64M x 72
32Mx16 (K4H511638D) * 4EA
64Mx8 (K4H510838D) * 8EA
64Mx8 (K4H510838D) * 9EA
64Mx8 (K4H510838D) * 16EA
64Mx8 (K4H510838D) * 18EA
Component Composition
Rev. 1.1 September 2006
B3(DDR333@CL=2.5)
133MHz
166MHz
2.5-3-3
-
DDR SDRAM
1,250mil
1,250mil
1,250mil
1,250mil
1,250mil
Height

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