hys64d32020gdl-6-b Infineon Technologies Corporation, hys64d32020gdl-6-b Datasheet - Page 6

• Manufacturer Part Number: hys64d32020gdl-6-b
• Description: 200-pin Small Outline Dual-in-line Memory Modules
• Manufacturer: Infineon Technologies Corporation

200-Pin Small Outline Dual-In-Line Memory Modules
SO-DIMM
1
1.1
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Table 1
Part Number Speed Code
Speed Grade
max. Clock Frequency @CL3
1.2
The HYS64D32020GDL–[5/6/7/8]–B and HYS64D1600xGDL–[6/7/8]–B are industry standard 200-Pin Small
Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M
designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are
mounted on the PC board. The DIMMs feature serial presence detect based on a serial E
2-pin I
available to the customer.
Data Sheet
Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules
One rank 16M
JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM)
Single +2.5 V ( 0.2 V) power supply
Built with 256 Mbit DDR SDRAMs organised as 16 in P–TSOPII–66–1 packages
Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
All inputs and outputs SSTL_2 compatible
Serial Presence Detect with E
Jedec standard form factor: 67.60 mm
Jedec standard reference layout Raw Cards A and C
DDR400 speed grade supported
Gold plated contacts
2
C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are
Overview
Features
Description
Performance
64 and two bank 32M
Module
@CL2.5
@CL2
Component
2
f
f
f
PROM
CK3
CK2.5
CK2
–5
DDR400B
PC3200–3033 PC2700–2533 PC2100–2033 PC1600–2022 —
200
166
133
31.75 mm
64 organization
6
–6
DDR333B
166
166
133
3.00 / 3.80 mm
–7
DDR266A
—
143
133
64 and 16M
HYS64D32020GDL–[5/6/7/8]–B
HYS64D1600xGDL–[6/7/8]–B
–8
DDR200
—
125
100
64. The memory array is
2
PROM device using the
V1.2, 2003-08
Unit
—
MHz
MHz
MHz