hys64d32020hdl-6-c Infineon Technologies Corporation, hys64d32020hdl-6-c Datasheet - Page 7

• Manufacturer Part Number: hys64d32020hdl-6-c
• Description: 200-pin Small Outline Dual-in-line Memory Modules
• Manufacturer: Infineon Technologies Corporation

Table 1
Type
HYS64D16000HDL–6–C
HYS64D32020HDL–6–C
Notes
1. All part numbers end with a place code designating the silicon-die revision. Reference information available on
2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the
1) RCD: Row-Column-Delay
Data Sheet
PC2700 (CL=2.5)
request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components.
latencies and SPD code definition (for example “2033–0” means CAS latency of 2.0 clocks, RCD
3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card
used for this module.
Ordering Information
Compliance Code
PC2700S–2533–0–C1
PC2700S–2533–0–A1
7
Description
one rank 128 MB SO-DIMM
two ranks 256 MB SO-DIMM
Small Outline DDR SDRAM Modules
HYS64D[32020/16000]HDL–6–C
SDRAM
Technology
256 MBit ( 16)
256 MBit ( 16)
Rev. 0.5, 2003-08
1)
Overview
latency of