mt9jsf12872pz Micron Semiconductor Products, mt9jsf12872pz Datasheet
mt9jsf12872pz
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mt9jsf12872pz Summary of contents
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... DDR3 SDRAM RDIMM MT9JSF12872PZ – 1GB MT9JSF25672PZ – 2GB Features • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module (RDIMM) • Fast data transfer rates: PC3-10600, PC3-8500, or PC3-6400 • 1GB (128 Meg x 72), 2GB (256 Meg x 72) • ...
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... Table 2: Addressing Parameter Refresh count Row address Device bank address Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters – 1GB Modules 1 Base device: MT41J128M8, 1Gb DDR3 SDRAM Module 2 Part Number Density MT9JSF12872P(I)Z-1G6__ MT9JSF12872P(I)Z-1G4__ MT9JSF12872P(I)Z-1G1__ Table 4: Part Numbers and Timing Parameters – ...
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Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin DDR3 RDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ25 61 REFDQ DQ0 33 DQS3 DQ1 ...
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Table 6: Pin Descriptions Symbol Type Description A[15:0] Input Address inputs: Provide the row address for ACTIVATE commands, and the column ad- dress and auto precharge bit (A10) for READ/WRITE commands, to select one location out of the memory array ...
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... Termination voltage: Used for control, command, and address (V TT – connect: These pins are not connected on the module. – function: Connected within the module, but provides no functionality. PDF: 09005aef83b4fcd7 jsf9c128_256x72pz.pdf – Rev. A 07/09 1GB, 2GB (x72, ECC, SR) 240-Pin Halogen-Free DDR3 RDIMM . /2). DD ...
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... DQ Map Table 7: Component-to-Module DQ Map Component Reference Component Number DQ Module U10 PDF: 09005aef83b4fcd7 jsf9c128_256x72pz.pdf – Rev. A 07/09 1GB, 2GB (x72, ECC, SR) 240-Pin Halogen-Free DDR3 RDIMM ...
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... Table 7: Component-to-Module DQ Map (Continued) Component Reference Component Number DQ Module DQ U12 PDF: 09005aef83b4fcd7 jsf9c128_256x72pz.pdf – Rev. A 07/09 1GB, 2GB (x72, ECC, SR) 240-Pin Halogen-Free DDR3 RDIMM Component Module Pin Reference Number Number 5 123 128 4 122 ...
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Functional Block Diagram Figure 2: Functional Block Diagram RS0# DQS0 DQS0# DM0/DQS9 NF/TDQS9# DM/ NF/ CS# DQS DQS# TDQS TDQS# DQ0 DQ DQ1 DQ DQ2 DQ U12 DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 ...
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... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
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... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45 “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...
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... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
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... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 10: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...
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Idd Specifications Table 11: DDR3 Idd Specifications and Conditions – 1GB Values are for the MT41J128M8 DDR3 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter Operating current 0: One ...
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Table 12: DDR3 Idd Specifications and Conditions – 2GB Values are for the MT41J256M8 DDR3 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) component data sheet Parameter Operating current 0: One bank ACTIVATE-to-PRE- ...
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... Control, command, address RESET#, MIRROR 0.65 × V RESET#, MIRROR CK, CK#, FBIN, FBIN# 0.5 × V CK, CK# Err_Out# Err_Out# tion of the DDR3 SDRAM RDIMMs. These are meant subset of the parameters for the specific device used on the module. 15 Min Nom Max 1.425 1.5 1.575 - 20mV 0.5 × V 0.51 × V ...
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... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 14: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current 3.3V DD Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...
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The interrupt mode enables software to reset EVENT# after a critical temperature thresh- old has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and ...
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Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 16: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...
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Table 17: Pointer Register Bits 0– Table 18: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...
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Table 20: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 21: Configuration Register (Address: 0x01) 15 ...
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Table 22: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...
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Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 23: Hysteresis Applied to Alarm ...
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Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...
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Table 27: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 28: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...
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... Front view 133.50 (5.256) 133.20 (5.244 0.76 (0.030) R 1.0 (0.039) TYP 123.0 (4.84) TYP Back view U10 5.0 (0.197) TYP 71.0 (2.79) TYP times occur. 25 Module Dimensions U6 23.3 (0.92) TYP 17.3 (0.68) TYP 9.5 (0.374) 0.80 (0.031) TYP TYP Pin 120 1.0 (0.039) R (8X) 3.1 (0.122) 2X TYP U11 U12 3.0 (0.118) 4X TYP Pin 121 47.0 (1.85) TYP Micron Technology, Inc. reserves the right to change products or specifications without notice. © ...