w6691 Winbond Electronics Corp America, w6691 Datasheet - Page 65
![no-image](/images/no-image-200.jpg)
w6691
Manufacturer Part Number
w6691
Description
Isdn S/t Interface Transceiver
Manufacturer
Winbond Electronics Corp America
Datasheet
1.W6691.pdf
(106 pages)
- Current page: 65 of 106
- Download datasheet (602Kb)
bits are read as zero. They are internally stored and pending until the mask bits are zero.
Note: All the interrupts in D_EXIR will be masked if the IMASK:D_EXI bit is set to "1".
8.7.9 D_ch Transmitter Status Register
Value after reset: 00H
XDOW
and is cleared only by XRST command.
XBZ
flag to the transmission of closing flag.
8.7.10 D_ch Receive Status Register
Value after reset: 20H
RDOV
data overflow condition will set both the status and interrupt bits. It is recommended that software must read
the RDOV bit after reading data from D_RFIFO when RMR or RME interrupt occurs. The software must
XDOW
At least one byte of data has been overwritten in the D_XFIFO. This bit is set by data overwritten condition
Setting the bit to "1" masks the corresponding interrupt source in D_EXIR register. Masked interrupt status
This bit indicates the D_HDLC transmitter is busy. The XBZ bit is set to”1” from the transmission of opening
A "1" indicates that the D_RFIFO is overflow. The incoming data will overwrite data in the receive FIFO. The
7
7
0
Transmitter Busy
RDOV
Receive Data Overflow
Transmit Data Overwritten
6
0
6
CRCE
XBZ
5
5
RMB
4
0
4
3
0
3
0
D_RSTA
2
0
2
0
65
D_XSTA
0
1
0
1
Read
0
0
0
0
Read
Preliminary W6691
Publication Release Date: Sep 2001
Address 0BH
Address 0AH
Revision 1.1
Related parts for w6691
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![w83l784r](/images/no-image3.png)
Part Number:
Description:
Winbond H/w Monitoring Ic
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83627thg](/images/no-image3.png)
Part Number:
Description:
Winbond Lpc I/o
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83601r](/images/no-image3.png)
Part Number:
Description:
Winbond Smbus Gpi/o
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83977atf](/images/no-image3.png)
Part Number:
Description:
Winbond I/o
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83194br-sd](/images/no-image3.png)
Part Number:
Description:
Winbond Clock Generator For Intel P4 Springdale Series Chipset
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83194br-603](/images/no-image3.png)
Part Number:
Description:
Winbond Clock Generator For Intel P4 Springdale Series Chipset
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83194br-619](/images/no-image3.png)
Part Number:
Description:
Winbond Clock Generator For Intel P4 Springdale Series Chipset P4 Springdale Series Chipset
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83194br-b](/images/no-image3.png)
Part Number:
Description:
Winbond Clock Generator For Intel P4 845 Series Chipset
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83195bg-341](/images/no-image3.png)
Part Number:
Description:
Winbond Clock Generator For Via P4/kt Series Chipset
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83195bg-101](/images/no-image3.png)
Part Number:
Description:
Winbond Clock Generator For Intel 915/925 Chipsets
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83l784r](/images/no-image3.png)
Part Number:
Description:
Winbond H/w Monitoring Ic
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83627thg](/images/no-image3.png)
Part Number:
Description:
Winbond Lpc I/o
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83601r](/images/no-image3.png)
Part Number:
Description:
Winbond Smbus Gpi/o
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![w83977atf](/images/no-image3.png)
Part Number:
Description:
Winbond I/o
Manufacturer:
Winbond Electronics Corp America
Datasheet:
![W90210F](/images/no-image3.png)
Part Number:
Description:
Pa-risc Embedded Controller
Manufacturer:
Winbond Electronics Corp America
Datasheet: