ntmsd3p102 ON Semiconductor, ntmsd3p102 Datasheet

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ntmsd3p102

Manufacturer Part Number
ntmsd3p102
Description
P-channel Enhancement-mode Power Mosfet And Schottky Diode Dual So-8 Package
Manufacturer
ON Semiconductor
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ntmsd3p102R2SG
Quantity:
42 500
NTMSD3P102R2
FETKY™
P-Channel Enhancement-Mode
Power MOSFET and Schottky Diode
Dual SO-8 Package
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum FR-4 or G-10 PCB, Steady State.
2. Mounted onto a 2″ square FR-4 Board (1 in sq, 2 oz Cu 0.06″ thick
3. Mounted onto a 2″ square FR-4 Board (1 in sq, 2 oz Cu 0.06″ thick single
4. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.
MOSFET MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 3
Drain-to-Source Voltage
Gate-to-Source Voltage - Continuous
Thermal Resistance -
Thermal Resistance -
Thermal Resistance -
Operating and Storage Temperature Range
Single Pulse Drain-to-Source Avalanche
Maximum Lead Temperature for Soldering
High Efficiency Components in a Single SO-8 Package
High Density Power MOSFET with Low R
Schottky Diode with Low V
Independent Pin-Outs for MOSFET and Schottky Die
Allowing for Flexibility in Application Use
Less Component Placement for Board Space Savings
SO-8 Surface Mount Package,
Mounting Information for SO-8 Package Provided
Pb-Free Packages are Available
DC-DC Converters
Low Voltage Motor Control
Power Management in Portable and Battery-Powered Products,
i.e.: Computers, Printers, PCMCIA Cards, Cellular and Cordless Telephones
single-sided), Steady State.
sided), t ≤ 10 seconds.
Junction-to-Ambient (Note 1)
Total Power Dissipation @ T
Continuous Drain Current @ T
Continuous Drain Current @ T
Pulsed Drain Current (Note 4)
Junction-to-Ambient (Note 2)
Total Power Dissipation @ T
Continuous Drain Current @ T
Continuous Drain Current @ T
Pulsed Drain Current (Note 4)
Junction-to-Ambient (Note 3)
Total Power Dissipation @ T
Continuous Drain Current @ T
Continuous Drain Current @ T
Pulsed Drain Current (Note 4)
Energy - Starting T
(V
Peak I
Purposes, 1/8″ from case for 10 seconds
DD
= -20 Vdc, V
L
= -7.5 Apk, L = 5 mH, R
Rating
GS
J
= 25°C
= -4.5 Vdc,
F
A
A
A
= 25°C
= 25°C
= 25°C
A
A
A
A
A
A
= 70°C
= 70°C
= 70°C
(T
= 25°C
= 25°C
= 25°C
G
J
= 25 W)
= 25°C unless otherwise noted).
DS(on)
Symbol
T
V
R
R
R
J
V
E
I
I
I
P
P
P
,
DSS
, T
T
I
I
DM
I
I
DM
I
I
DM
qJA
qJA
qJA
GS
AS
D
D
D
D
D
D
D
D
D
L
stg
- 55 to
Value
-2.34
-1.87
-3.05
-2.44
-3.86
-3.10
+150
"20
0.73
-8.0
1.25
62.5
-20
171
100
-12
-15
140
260
2.0
1
°C/W
°C/W
°C/W
Unit
mJ
°C
°C
W
W
W
V
V
A
A
A
A
A
A
A
A
A
NTMSD3P102R2
NTMSD3P102R2G
NTMSD3P102R2SG
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
CASE 751
STYLE 18
8
SO-8
(Note: Microdot may be in either location)
Device
1
ORDERING INFORMATION
0.085 W @ V
E3P1
xx
A
Y
WW
G
470 mV @ I
SCHOTTKY DIODE
http://onsemi.com
G
-3.05 AMPERES
A
A
S
1.0 AMPERE
-20 VOLTS
20 VOLTS
= Device Code
= 02 or S
= Assembly Location
= Year
= Work Week
= Pb-Free Package
MOSFET
(TOP VIEW)
(Pb-Free)
(Pb-Free)
MARKING DIAGRAM &
3
Package
4
1
2
SO-8
SO-8
SO-8
PIN ASSIGNMENT
Publication Order Number:
GS
F
= 1.0 A
8
1
8
7
5
6
= -10 V
C
A
NTMSD3P102R2/D
AYWW G
2500/Tape & Reel
2500/Tape & Reel
2500/Tape & Reel
E3P1xx
C
A
C
C
D
D
G
Shipping
D D
S G

Related parts for ntmsd3p102

ntmsd3p102 Summary of contents

Page 1

... E3P1 = Device Code Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping SO-8 2500/Tape & Reel SO-8 2500/Tape & Reel (Pb-Free) SO-8 2500/Tape & Reel (Pb-Free) Publication Order Number: NTMSD3P102R2/D † ...

Page 2

... SCHOTTKY ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage Maximum Instantaneous Forward Voltage Maximum Instantaneous Reverse Current Maximum Voltage Rate of Change 8. Indicates Pulse Test: Pulse Width = 300 ms max, Duty Cycle = 2%. NTMSD3P102R2 = 25°C unless otherwise noted) J Rating = 105° 25°C unless otherwise noted) (Note 8) ...

Page 3

... Reverse Recovery Time Reverse Recovery Stored Charge 9. Handling precautions to protect against electrostatic discharge are mandatory. 10. Indicates Pulse Test: Pulse Width = 300 ms max, Duty Cycle = 2%. 11. Switching characteristics are independent of operating junction temperature. NTMSD3P102R2 (T = 25°C unless otherwise noted) (Note 9) J Symbol ...

Page 4

... DRAIN-TO-SOURCE VOLTAGE (VOLTS) DS Figure 1. On-Region Characteristics 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0. GATE-TO-SOURCE VOLTAGE (VOLTS) GS Figure 3. On-Resistance vs. Gate-to-Source Voltage 1.6 1.4 1.2 1 0.8 0.6 -50 NTMSD3P102R2 - 1 25° -3 ...

Page 5

... 100 GATE RESISTANCE (W) G Figure 10. Resistive Switching Time Variation vs. Gate Resistance NTMSD3P102R2 V DS 1200 C iss 1000 800 C rss 600 400 200 T = 25° GATE-TO-SOURCE OR DRAIN-TO-SOURCE ...

Page 6

... TYPICAL SCHOTTKY ELECTRICAL CHARACTERISTICS 125°C J 1.0 85°C 25°C - 40° C 0.1 0.1 0.2 0.3 0.4 0.5 0.6 0 INSTANTANEOUS FORWARD VOLTAGE (VOLTS) F Figure 14. Typical Forward Voltage NTMSD3P102R2 di/ TIME 0. Normalized Steady State (1″ pad) qJA Chip Junction 2.32 W 18.5 W 50.9 W 0.0014 F 0.0073 F 0.022 F ...

Page 7

... T = 125°C J 1E-3 85°C 1E-4 1E-5 25°C 1E-6 1E REVERSE VOLTAGE (VOLTS) R Figure 16. Typical Reverse Current 1000 TYPICAL CAPACITANCE 170 pF 100 REVERSE VOLTAGE (VOLTS) R Figure 18. Typical Capacitance NTMSD3P102R2 1E-1 1E-2 1E-3 1E-4 1E Figure 17. Maximum Reverse Current 1.6 1.4 SQUARE WAVE 1.2 1 0 ...

Page 8

... TYPICAL SCHOTTKY ELECTRICAL CHARACTERISTICS 0.7 0.6 0.5 0 0.3 0.2 0 AVERAGE FORWARD CURRENT (AMPS) O Figure 20. Forward Power Dissipation 1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 1.0E-05 1.0E-04 1.0E-03 Figure 21. Schottky Thermal Response NTMSD3P102R2 dc SQUARE WAVE = 5 0.5 1.0 1.5 NORMALIZED TO R 0.0031 W 0.0154 W CHIP JUNCTION 0.0014 F 0.0082 F 1.0E-02 1.0E-01 1.0E+00 t, TIME (s) http://onsemi.com 8 2.0 AT STEADY STATE (1″ ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT:  Literature Distribution Center for ON Semiconductor  P.O. Box 5163, Denver, Colorado 80217 USA  Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  Email: orderlit@onsemi.com NTMSD3P102R2 PACKAGE DIMENSIONS SO-8 NB CASE 751-07 ISSUE AH 0.25 (0.010 ...

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