mlp2012 TDK Corp., mlp2012 Datasheet - Page 7

• Manufacturer Part Number: mlp2012
• Description: Multilayer Chip Inductors Coils For Dc To Dc Converters
• Manufacturer: TDK Corp.

SMD Inductors(Coils)
For Power Line(Multilayer, Magnetic Shielded)
MLP Series MLP2520
In response to market demands for smaller mobile devices with a
longer lasting life, mounted switching supply circuits with even
higher frequencies are now being developed.
With optimized materials the MLP2520 type contributes to the
improved efficiency of power sources, and reduces the losses
caused by ferrite, even if the products are used for supply circuits
with high drive frequencies.
FEATURES
• Optimized ferrite materials enable the reduction of losses.
• Compared to the existing MLP2520 type, DC superposition
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Cellular phones, DSCs, DVCs, HDs, etc.
SPECIFICATIONS
Operating temperature range
Storage temperature range
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application is considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
characteristics have been substantially improved.
soldering.
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
10s max.
–40 to +125°C
[Including self-temperature rise]
–40 to +85°C
Natural
cooling
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Product characteristics classification code
(4) Inductance value
(5) Management number
(6) Packaging style
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
MLP 2520 S 1R0 M
(1)
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
2520
S
1R0
1R5
2R2
3R3
4R7
• S1R0S: 1.2µH, S2R2S: 2.5µH
M
S
T
(2)
(3) (4) (5) (6)
Thickness T(mm)
1.0mm max.
1.2mm max.
T
Taping [reel]
2.5×2.0mm
STD
1.0µH
1.5µH
2.2µH
3.3µH
4.7µH
t=1.0mm max.
t=1.2mm max.
Conformity to RoHS Directive
001-04 / 20110512 / e533_mlp
Quantity
3000 pieces/reel
3000 pieces/reel
(6/8)